Bond strength tests between silicon wafers and duran tubes (fusion bonded fluidic interconnects)

I. Fazal, Johan W. Berenschot, J.H. de Boer, Henricus V. Jansen, Michael Curt Elwenspoek

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    6 Citations (Scopus)
    402 Downloads (Pure)

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