Abstract
Capillary bonding of glass tubes to silicon wafers has been elaborated. After proper preparation, tubes are placed on silicon substrates and specimens are annealed at sintering temperatures of glass. The resulting interconnect is capable of working above 70 bars of filling pressure and
the bond is completely hermetic. However, due to high
temperature annealing in air, surface devitrification has been observed on glass, which can be avoided by vacuum
annealing
Original language | Undefined |
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Title of host publication | Proceedings of the 19th micromechanics Europe conference |
Place of Publication | Italy |
Publisher | VDI/VDE |
Pages | - |
Number of pages | 4 |
ISBN (Print) | 978-3-00-025529-8 |
Publication status | Published - Sept 2008 |
Event | 19th MicroMechanics Europe Workshop, MME 2008 - Aachen, Germany Duration: 28 Sept 2008 → 30 Sept 2008 Conference number: 19 |
Publication series
Name | |
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Publisher | VDI/VDE |
Workshop
Workshop | 19th MicroMechanics Europe Workshop, MME 2008 |
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Abbreviated title | MME |
Country/Territory | Germany |
City | Aachen |
Period | 28/09/08 → 30/09/08 |
Keywords
- EWI-14744
- METIS-255430
- IR-65256