Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate

Edin Sarajlic, Meint J. de Boer, Henricus V. Jansen, N. Arnal, M. Puech, Gijsbertus J.M. Krijnen, Michael Curt Elwenspoek

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    7 Citations (Scopus)
    63 Downloads (Pure)

    Abstract

    We present a bulk micromachining technology, based on vertical trench isolation, for fabrication of two-level MEMS in a standard monocrystalline silicon substrate. The technology, suitable for full integration with on-chip electronics, employs double-side processing to obtain functional micromechanical structures on both sides of the substrate. Etching and release of these microstructures are performed in a single plasma chamber allowing dry, low temperature processing. Utilizing double-side processing, high-aspect-ratio monocrystalline MEMS with integrated vertical electrical insulation on fixed and even on movable parts are fabricated on one side of the wafer and, at the same time, mechanically and electrically coupled with released micromechanical structures on the opposite side. This opens new design opportunities to improve performance and functionality of MEMS devices. The presented technology is employed for fabrication of electrostatic XY-scanners for probe-based data storage with a significantly larger effective recording area proving the feasibility and large potential of this technology
    Original languageUndefined
    Title of host publicationProceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005
    Place of PublicationLos Alamitos
    PublisherIEEE
    Pages1404-1405
    Number of pages2
    ISBN (Print)0-7803-8994-8
    DOIs
    Publication statusPublished - Jun 2005
    Event13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005 - Seoul, Korea, Republic of
    Duration: 5 Jun 20059 Jun 2005
    Conference number: 13

    Publication series

    Name
    PublisherIEEE
    Volume2

    Conference

    Conference13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005
    Abbreviated titleTRANSDUCERS
    CountryKorea, Republic of
    CitySeoul
    Period5/06/059/06/05

    Keywords

    • EWI-10271
    • METIS-224199
    • IR-52580

    Cite this

    Sarajlic, E., de Boer, M. J., Jansen, H. V., Arnal, N., Puech, M., Krijnen, G. J. M., & Elwenspoek, M. C. (2005). Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate. In Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005 (pp. 1404-1405). Los Alamitos: IEEE. https://doi.org/10.1109/SENSOR.2005.1497344