Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate

Edin Sarajlic, Meint J. de Boer, Henricus V. Jansen, N. Arnal, M. Puech, Gijsbertus J.M. Krijnen, Michael Curt Elwenspoek

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    7 Citations (Scopus)
    60 Downloads (Pure)

    Abstract

    We present a bulk micromachining technology, based on vertical trench isolation, for fabrication of two-level MEMS in a standard monocrystalline silicon substrate. The technology, suitable for full integration with on-chip electronics, employs double-side processing to obtain functional micromechanical structures on both sides of the substrate. Etching and release of these microstructures are performed in a single plasma chamber allowing dry, low temperature processing. Utilizing double-side processing, high-aspect-ratio monocrystalline MEMS with integrated vertical electrical insulation on fixed and even on movable parts are fabricated on one side of the wafer and, at the same time, mechanically and electrically coupled with released micromechanical structures on the opposite side. This opens new design opportunities to improve performance and functionality of MEMS devices. The presented technology is employed for fabrication of electrostatic XY-scanners for probe-based data storage with a significantly larger effective recording area proving the feasibility and large potential of this technology
    Original languageUndefined
    Title of host publicationProceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005
    Place of PublicationLos Alamitos
    PublisherIEEE
    Pages1404-1405
    Number of pages2
    ISBN (Print)0-7803-8994-8
    DOIs
    Publication statusPublished - Jun 2005
    Event13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005 - Seoul, Korea, Republic of
    Duration: 5 Jun 20059 Jun 2005
    Conference number: 13

    Publication series

    Name
    PublisherIEEE
    Volume2

    Conference

    Conference13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005
    Abbreviated titleTRANSDUCERS
    CountryKorea, Republic of
    CitySeoul
    Period5/06/059/06/05

    Keywords

    • EWI-10271
    • METIS-224199
    • IR-52580

    Cite this

    Sarajlic, E., de Boer, M. J., Jansen, H. V., Arnal, N., Puech, M., Krijnen, G. J. M., & Elwenspoek, M. C. (2005). Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate. In Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005 (pp. 1404-1405). Los Alamitos: IEEE. https://doi.org/10.1109/SENSOR.2005.1497344
    Sarajlic, Edin ; de Boer, Meint J. ; Jansen, Henricus V. ; Arnal, N. ; Puech, M. ; Krijnen, Gijsbertus J.M. ; Elwenspoek, Michael Curt. / Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate. Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005. Los Alamitos : IEEE, 2005. pp. 1404-1405
    @inproceedings{cf8a46c1139a4962bc5597eeaaa497a3,
    title = "Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate",
    abstract = "We present a bulk micromachining technology, based on vertical trench isolation, for fabrication of two-level MEMS in a standard monocrystalline silicon substrate. The technology, suitable for full integration with on-chip electronics, employs double-side processing to obtain functional micromechanical structures on both sides of the substrate. Etching and release of these microstructures are performed in a single plasma chamber allowing dry, low temperature processing. Utilizing double-side processing, high-aspect-ratio monocrystalline MEMS with integrated vertical electrical insulation on fixed and even on movable parts are fabricated on one side of the wafer and, at the same time, mechanically and electrically coupled with released micromechanical structures on the opposite side. This opens new design opportunities to improve performance and functionality of MEMS devices. The presented technology is employed for fabrication of electrostatic XY-scanners for probe-based data storage with a significantly larger effective recording area proving the feasibility and large potential of this technology",
    keywords = "EWI-10271, METIS-224199, IR-52580",
    author = "Edin Sarajlic and {de Boer}, {Meint J.} and Jansen, {Henricus V.} and N. Arnal and M. Puech and Krijnen, {Gijsbertus J.M.} and Elwenspoek, {Michael Curt}",
    year = "2005",
    month = "6",
    doi = "10.1109/SENSOR.2005.1497344",
    language = "Undefined",
    isbn = "0-7803-8994-8",
    publisher = "IEEE",
    pages = "1404--1405",
    booktitle = "Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005",
    address = "United States",

    }

    Sarajlic, E, de Boer, MJ, Jansen, HV, Arnal, N, Puech, M, Krijnen, GJM & Elwenspoek, MC 2005, Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate. in Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005. IEEE, Los Alamitos, pp. 1404-1405, 13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005, Seoul, Korea, Republic of, 5/06/05. https://doi.org/10.1109/SENSOR.2005.1497344

    Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate. / Sarajlic, Edin; de Boer, Meint J.; Jansen, Henricus V.; Arnal, N.; Puech, M.; Krijnen, Gijsbertus J.M.; Elwenspoek, Michael Curt.

    Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005. Los Alamitos : IEEE, 2005. p. 1404-1405.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    TY - GEN

    T1 - Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate

    AU - Sarajlic, Edin

    AU - de Boer, Meint J.

    AU - Jansen, Henricus V.

    AU - Arnal, N.

    AU - Puech, M.

    AU - Krijnen, Gijsbertus J.M.

    AU - Elwenspoek, Michael Curt

    PY - 2005/6

    Y1 - 2005/6

    N2 - We present a bulk micromachining technology, based on vertical trench isolation, for fabrication of two-level MEMS in a standard monocrystalline silicon substrate. The technology, suitable for full integration with on-chip electronics, employs double-side processing to obtain functional micromechanical structures on both sides of the substrate. Etching and release of these microstructures are performed in a single plasma chamber allowing dry, low temperature processing. Utilizing double-side processing, high-aspect-ratio monocrystalline MEMS with integrated vertical electrical insulation on fixed and even on movable parts are fabricated on one side of the wafer and, at the same time, mechanically and electrically coupled with released micromechanical structures on the opposite side. This opens new design opportunities to improve performance and functionality of MEMS devices. The presented technology is employed for fabrication of electrostatic XY-scanners for probe-based data storage with a significantly larger effective recording area proving the feasibility and large potential of this technology

    AB - We present a bulk micromachining technology, based on vertical trench isolation, for fabrication of two-level MEMS in a standard monocrystalline silicon substrate. The technology, suitable for full integration with on-chip electronics, employs double-side processing to obtain functional micromechanical structures on both sides of the substrate. Etching and release of these microstructures are performed in a single plasma chamber allowing dry, low temperature processing. Utilizing double-side processing, high-aspect-ratio monocrystalline MEMS with integrated vertical electrical insulation on fixed and even on movable parts are fabricated on one side of the wafer and, at the same time, mechanically and electrically coupled with released micromechanical structures on the opposite side. This opens new design opportunities to improve performance and functionality of MEMS devices. The presented technology is employed for fabrication of electrostatic XY-scanners for probe-based data storage with a significantly larger effective recording area proving the feasibility and large potential of this technology

    KW - EWI-10271

    KW - METIS-224199

    KW - IR-52580

    U2 - 10.1109/SENSOR.2005.1497344

    DO - 10.1109/SENSOR.2005.1497344

    M3 - Conference contribution

    SN - 0-7803-8994-8

    SP - 1404

    EP - 1405

    BT - Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005

    PB - IEEE

    CY - Los Alamitos

    ER -

    Sarajlic E, de Boer MJ, Jansen HV, Arnal N, Puech M, Krijnen GJM et al. Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate. In Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005. Los Alamitos: IEEE. 2005. p. 1404-1405 https://doi.org/10.1109/SENSOR.2005.1497344