Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate

Edin Sarajlic, Meint J. de Boer, Henricus V. Jansen, N. Arnal, M. Puech, Gijsbertus J.M. Krijnen, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

7 Citations (Scopus)
56 Downloads (Pure)

Abstract

We present a bulk micromachining technology, based on vertical trench isolation, for fabrication of two-level MEMS in a standard monocrystalline silicon substrate. The technology, suitable for full integration with on-chip electronics, employs double-side processing to obtain functional micromechanical structures on both sides of the substrate. Etching and release of these microstructures are performed in a single plasma chamber allowing dry, low temperature processing. Utilizing double-side processing, high-aspect-ratio monocrystalline MEMS with integrated vertical electrical insulation on fixed and even on movable parts are fabricated on one side of the wafer and, at the same time, mechanically and electrically coupled with released micromechanical structures on the opposite side. This opens new design opportunities to improve performance and functionality of MEMS devices. The presented technology is employed for fabrication of electrostatic XY-scanners for probe-based data storage with a significantly larger effective recording area proving the feasibility and large potential of this technology
Original languageUndefined
Title of host publicationProceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005
Place of PublicationLos Alamitos
PublisherIEEE
Pages1404-1405
Number of pages2
ISBN (Print)0-7803-8994-8
DOIs
Publication statusPublished - Jun 2005
Event13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005 - Seoul, Korea, Republic of
Duration: 5 Jun 20059 Jun 2005
Conference number: 13

Publication series

Name
PublisherIEEE
Volume2

Conference

Conference13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005
Abbreviated titleTRANSDUCERS
CountryKorea, Republic of
CitySeoul
Period5/06/059/06/05

Keywords

  • EWI-10271
  • METIS-224199
  • IR-52580

Cite this

Sarajlic, E., de Boer, M. J., Jansen, H. V., Arnal, N., Puech, M., Krijnen, G. J. M., & Elwenspoek, M. C. (2005). Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate. In Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005 (pp. 1404-1405). Los Alamitos: IEEE. https://doi.org/10.1109/SENSOR.2005.1497344
Sarajlic, Edin ; de Boer, Meint J. ; Jansen, Henricus V. ; Arnal, N. ; Puech, M. ; Krijnen, Gijsbertus J.M. ; Elwenspoek, Michael Curt. / Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate. Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005. Los Alamitos : IEEE, 2005. pp. 1404-1405
@inproceedings{cf8a46c1139a4962bc5597eeaaa497a3,
title = "Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate",
abstract = "We present a bulk micromachining technology, based on vertical trench isolation, for fabrication of two-level MEMS in a standard monocrystalline silicon substrate. The technology, suitable for full integration with on-chip electronics, employs double-side processing to obtain functional micromechanical structures on both sides of the substrate. Etching and release of these microstructures are performed in a single plasma chamber allowing dry, low temperature processing. Utilizing double-side processing, high-aspect-ratio monocrystalline MEMS with integrated vertical electrical insulation on fixed and even on movable parts are fabricated on one side of the wafer and, at the same time, mechanically and electrically coupled with released micromechanical structures on the opposite side. This opens new design opportunities to improve performance and functionality of MEMS devices. The presented technology is employed for fabrication of electrostatic XY-scanners for probe-based data storage with a significantly larger effective recording area proving the feasibility and large potential of this technology",
keywords = "EWI-10271, METIS-224199, IR-52580",
author = "Edin Sarajlic and {de Boer}, {Meint J.} and Jansen, {Henricus V.} and N. Arnal and M. Puech and Krijnen, {Gijsbertus J.M.} and Elwenspoek, {Michael Curt}",
year = "2005",
month = "6",
doi = "10.1109/SENSOR.2005.1497344",
language = "Undefined",
isbn = "0-7803-8994-8",
publisher = "IEEE",
pages = "1404--1405",
booktitle = "Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005",
address = "United States",

}

Sarajlic, E, de Boer, MJ, Jansen, HV, Arnal, N, Puech, M, Krijnen, GJM & Elwenspoek, MC 2005, Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate. in Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005. IEEE, Los Alamitos, pp. 1404-1405, 13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005, Seoul, Korea, Republic of, 5/06/05. https://doi.org/10.1109/SENSOR.2005.1497344

Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate. / Sarajlic, Edin; de Boer, Meint J.; Jansen, Henricus V.; Arnal, N.; Puech, M.; Krijnen, Gijsbertus J.M.; Elwenspoek, Michael Curt.

Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005. Los Alamitos : IEEE, 2005. p. 1404-1405.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

TY - GEN

T1 - Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate

AU - Sarajlic, Edin

AU - de Boer, Meint J.

AU - Jansen, Henricus V.

AU - Arnal, N.

AU - Puech, M.

AU - Krijnen, Gijsbertus J.M.

AU - Elwenspoek, Michael Curt

PY - 2005/6

Y1 - 2005/6

N2 - We present a bulk micromachining technology, based on vertical trench isolation, for fabrication of two-level MEMS in a standard monocrystalline silicon substrate. The technology, suitable for full integration with on-chip electronics, employs double-side processing to obtain functional micromechanical structures on both sides of the substrate. Etching and release of these microstructures are performed in a single plasma chamber allowing dry, low temperature processing. Utilizing double-side processing, high-aspect-ratio monocrystalline MEMS with integrated vertical electrical insulation on fixed and even on movable parts are fabricated on one side of the wafer and, at the same time, mechanically and electrically coupled with released micromechanical structures on the opposite side. This opens new design opportunities to improve performance and functionality of MEMS devices. The presented technology is employed for fabrication of electrostatic XY-scanners for probe-based data storage with a significantly larger effective recording area proving the feasibility and large potential of this technology

AB - We present a bulk micromachining technology, based on vertical trench isolation, for fabrication of two-level MEMS in a standard monocrystalline silicon substrate. The technology, suitable for full integration with on-chip electronics, employs double-side processing to obtain functional micromechanical structures on both sides of the substrate. Etching and release of these microstructures are performed in a single plasma chamber allowing dry, low temperature processing. Utilizing double-side processing, high-aspect-ratio monocrystalline MEMS with integrated vertical electrical insulation on fixed and even on movable parts are fabricated on one side of the wafer and, at the same time, mechanically and electrically coupled with released micromechanical structures on the opposite side. This opens new design opportunities to improve performance and functionality of MEMS devices. The presented technology is employed for fabrication of electrostatic XY-scanners for probe-based data storage with a significantly larger effective recording area proving the feasibility and large potential of this technology

KW - EWI-10271

KW - METIS-224199

KW - IR-52580

U2 - 10.1109/SENSOR.2005.1497344

DO - 10.1109/SENSOR.2005.1497344

M3 - Conference contribution

SN - 0-7803-8994-8

SP - 1404

EP - 1405

BT - Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005

PB - IEEE

CY - Los Alamitos

ER -

Sarajlic E, de Boer MJ, Jansen HV, Arnal N, Puech M, Krijnen GJM et al. Bulk micromachining technology for fabrication of two-level mems in standard silicon substrate. In Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005. Los Alamitos: IEEE. 2005. p. 1404-1405 https://doi.org/10.1109/SENSOR.2005.1497344