Challenges in Risk-based EMC for MRI Systems

Simon Rendon Velez; Mark J.A.M. van Helvoort; Robert Vogt-Ardatjew; Barbel van den Berg; Frank Leferink

doi:10.1109/EMCEurope57790.2023.10274190

Challenges in Risk-based EMC for MRI Systems

Simon Rendon Velez^*
, Mark J.A.M. van Helvoort
, Robert Vogt-Ardatjew
, Barbel van den Berg
, Frank Leferink

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

3 Citations (Scopus)

308 Downloads (Pure)

Abstract

This paper gives an overview of risk-based EMC for high-field strength magnetic resonance imaging (MRI) systems. The challenges when applying this approach are described. First, the unreliability of on-site testing inside hospitals unveils the need to correlate in-situ measurements with measurements performed in an EMC laboratory. For MRI systems, this is particularly challenging due to the under-moded behavior of its electromagnetic environment. Second, state-of-the-art risk analysis techniques oversimplify the complexity of novel and innovative medical equipment. To deal with this complexity, new approaches to risk analysis are required. A promising technique is STPA, which not only considers risk due to component failures, but also due to complex interactions between hardware, software, and human components.

Original language	English
Title of host publication	2023 International Symposium on Electromagnetic Compatibility - EMC Europe 2023
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	1-6
Number of pages	6
ISBN (Electronic)	979-8-3503-2400-6
ISBN (Print)	979-8-3503-2401-3
DOIs	https://doi.org/10.1109/EMCEurope57790.2023.10274190
Publication status	Published - 10 Oct 2023
Event	International Symposium and Exhibition on Electromagnetic Compatibility, EMC Europe 2023 - Krakow, Poland Duration: 4 Sept 2023 → 8 Sept 2023 http://emceurope2023.org

Publication series

Name	IEEE International Symposium on Electromagnetic Compatibility
Publisher	IEEE
Volume	2023
ISSN (Print)	1077-4076
ISSN (Electronic)	2158-1118

Conference

Conference	International Symposium and Exhibition on Electromagnetic Compatibility, EMC Europe 2023
Abbreviated title	EMC Europe 2023
Country/Territory	Poland
City	Krakow
Period	4/09/23 → 8/09/23
Internet address	http://emceurope2023.org

Keywords

2023 OA procedure
On-site testing
Risk-based EMC
STPA
MRI

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10.1109/EMCEurope57790.2023.10274190

ArticleFinal published version, 1.26 MBLicence: Taverne

Cite this

Velez, S. R., van Helvoort, M. J. A. M., Vogt-Ardatjew, R., van den Berg, B., & Leferink, F. (2023). Challenges in Risk-based EMC for MRI Systems. In 2023 International Symposium on Electromagnetic Compatibility - EMC Europe 2023 (pp. 1-6). Article 23865693 (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2023). IEEE. https://doi.org/10.1109/EMCEurope57790.2023.10274190

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title = "Challenges in Risk-based EMC for MRI Systems",

abstract = "This paper gives an overview of risk-based EMC for high-field strength magnetic resonance imaging (MRI) systems. The challenges when applying this approach are described. First, the unreliability of on-site testing inside hospitals unveils the need to correlate in-situ measurements with measurements performed in an EMC laboratory. For MRI systems, this is particularly challenging due to the under-moded behavior of its electromagnetic environment. Second, state-of-the-art risk analysis techniques oversimplify the complexity of novel and innovative medical equipment. To deal with this complexity, new approaches to risk analysis are required. A promising technique is STPA, which not only considers risk due to component failures, but also due to complex interactions between hardware, software, and human components.",

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author = "Velez, \{Simon Rendon\} and \{van Helvoort\}, \{Mark J.A.M.\} and Robert Vogt-Ardatjew and \{van den Berg\}, Barbel and Frank Leferink",

note = "Funding Information: This research has received funding from the European Union{\textquoteright}s Horizon 2020 research and innovation programme under the Marie Sk{\l}odowska-Curie Grant Agreement No 955.816 (MSCA-ETN ETERNITY). Funding Information: This research has received funding from the European Union's Horizon 2020 research and innovation programme under the Marie Sklodowska- Curie Grant Agreement No 955.816 (MSCA-ETN ETERNITY). Publisher Copyright: {\textcopyright} 2023 IEEE.; International Symposium and Exhibition on Electromagnetic Compatibility, EMC Europe 2023, EMC Europe 2023 ; Conference date: 04-09-2023 Through 08-09-2023",

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language = "English",

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Velez, SR, van Helvoort, MJAM, Vogt-Ardatjew, R, van den Berg, B & Leferink, F 2023, Challenges in Risk-based EMC for MRI Systems. in 2023 International Symposium on Electromagnetic Compatibility - EMC Europe 2023., 23865693, IEEE International Symposium on Electromagnetic Compatibility, vol. 2023, IEEE, Piscataway, NJ, pp. 1-6, International Symposium and Exhibition on Electromagnetic Compatibility, EMC Europe 2023, Krakow, Poland, 4/09/23. https://doi.org/10.1109/EMCEurope57790.2023.10274190

Challenges in Risk-based EMC for MRI Systems. / Velez, Simon Rendon; van Helvoort, Mark J.A.M.; Vogt-Ardatjew, Robert et al.
2023 International Symposium on Electromagnetic Compatibility - EMC Europe 2023. Piscataway, NJ: IEEE, 2023. p. 1-6 23865693 (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - van Helvoort, Mark J.A.M.

AU - Vogt-Ardatjew, Robert

AU - van den Berg, Barbel

AU - Leferink, Frank

N1 - Funding Information: This research has received funding from the European Union’s Horizon 2020 research and innovation programme under the Marie Skłodowska-Curie Grant Agreement No 955.816 (MSCA-ETN ETERNITY). Funding Information: This research has received funding from the European Union's Horizon 2020 research and innovation programme under the Marie Sklodowska- Curie Grant Agreement No 955.816 (MSCA-ETN ETERNITY). Publisher Copyright: © 2023 IEEE.

PY - 2023/10/10

Y1 - 2023/10/10

N2 - This paper gives an overview of risk-based EMC for high-field strength magnetic resonance imaging (MRI) systems. The challenges when applying this approach are described. First, the unreliability of on-site testing inside hospitals unveils the need to correlate in-situ measurements with measurements performed in an EMC laboratory. For MRI systems, this is particularly challenging due to the under-moded behavior of its electromagnetic environment. Second, state-of-the-art risk analysis techniques oversimplify the complexity of novel and innovative medical equipment. To deal with this complexity, new approaches to risk analysis are required. A promising technique is STPA, which not only considers risk due to component failures, but also due to complex interactions between hardware, software, and human components.

AB - This paper gives an overview of risk-based EMC for high-field strength magnetic resonance imaging (MRI) systems. The challenges when applying this approach are described. First, the unreliability of on-site testing inside hospitals unveils the need to correlate in-situ measurements with measurements performed in an EMC laboratory. For MRI systems, this is particularly challenging due to the under-moded behavior of its electromagnetic environment. Second, state-of-the-art risk analysis techniques oversimplify the complexity of novel and innovative medical equipment. To deal with this complexity, new approaches to risk analysis are required. A promising technique is STPA, which not only considers risk due to component failures, but also due to complex interactions between hardware, software, and human components.

KW - 2023 OA procedure

KW - On-site testing

KW - Risk-based EMC

KW - STPA

KW - MRI

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DO - 10.1109/EMCEurope57790.2023.10274190

M3 - Conference contribution

AN - SCOPUS:85174632793

SN - 979-8-3503-2401-3

T3 - IEEE International Symposium on Electromagnetic Compatibility

SP - 1

EP - 6

BT - 2023 International Symposium on Electromagnetic Compatibility - EMC Europe 2023

PB - IEEE

CY - Piscataway, NJ

T2 - International Symposium and Exhibition on Electromagnetic Compatibility, EMC Europe 2023

Y2 - 4 September 2023 through 8 September 2023

ER -

Challenges in Risk-based EMC for MRI Systems

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