Characterization and testing of polymer-oxide adhesion to improve the packaging reliability of ISFETs

R.E.G. van Hal, P. Bergveld, J.F.J. Engbersen, D.N. Reinhoudt

Research output: Contribution to journalArticleAcademicpeer-review

12 Citations (Scopus)
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Abstract

One of the problems preventing the widespread commercialization of ISFETs is the lack of reliable packaging. The most important parameter in the packaging is the interface adhesion between the encapsulant and the chip. This interface is characterized by two independent types of measurements. Long-term C-V measurements are used to check the water penetration along the interface. CO2 and NH3 response measurements are used to show the existence of condensed water at the interface. It is shown that the use of a suitable coupling agent improves the adhesion. However, vacuoles at the interface can still be formed and these can cause a breakdown of the packaging. The use of thicker layers of encapsulant will only postpone this breakdown.
Original languageEnglish
Pages (from-to)17-26
JournalSensors and actuators. B: Chemical
Volume23
Issue number1
DOIs
Publication statusPublished - 1995

Fingerprint

Ion sensitive field effect transistors
packaging
Oxides
Packaging
Polymers
adhesion
Adhesion
oxides
polymers
Testing
Water
Coupling agents
breakdown
commercialization
water
penetration
chips
causes

Keywords

  • ISFETs
  • Packaging

Cite this

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title = "Characterization and testing of polymer-oxide adhesion to improve the packaging reliability of ISFETs",
abstract = "One of the problems preventing the widespread commercialization of ISFETs is the lack of reliable packaging. The most important parameter in the packaging is the interface adhesion between the encapsulant and the chip. This interface is characterized by two independent types of measurements. Long-term C-V measurements are used to check the water penetration along the interface. CO2 and NH3 response measurements are used to show the existence of condensed water at the interface. It is shown that the use of a suitable coupling agent improves the adhesion. However, vacuoles at the interface can still be formed and these can cause a breakdown of the packaging. The use of thicker layers of encapsulant will only postpone this breakdown.",
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Characterization and testing of polymer-oxide adhesion to improve the packaging reliability of ISFETs. / van Hal, R.E.G.; Bergveld, P.; Engbersen, J.F.J.; Reinhoudt, D.N.

In: Sensors and actuators. B: Chemical, Vol. 23, No. 1, 1995, p. 17-26.

Research output: Contribution to journalArticleAcademicpeer-review

TY - JOUR

T1 - Characterization and testing of polymer-oxide adhesion to improve the packaging reliability of ISFETs

AU - van Hal, R.E.G.

AU - Bergveld, P.

AU - Engbersen, J.F.J.

AU - Reinhoudt, D.N.

PY - 1995

Y1 - 1995

N2 - One of the problems preventing the widespread commercialization of ISFETs is the lack of reliable packaging. The most important parameter in the packaging is the interface adhesion between the encapsulant and the chip. This interface is characterized by two independent types of measurements. Long-term C-V measurements are used to check the water penetration along the interface. CO2 and NH3 response measurements are used to show the existence of condensed water at the interface. It is shown that the use of a suitable coupling agent improves the adhesion. However, vacuoles at the interface can still be formed and these can cause a breakdown of the packaging. The use of thicker layers of encapsulant will only postpone this breakdown.

AB - One of the problems preventing the widespread commercialization of ISFETs is the lack of reliable packaging. The most important parameter in the packaging is the interface adhesion between the encapsulant and the chip. This interface is characterized by two independent types of measurements. Long-term C-V measurements are used to check the water penetration along the interface. CO2 and NH3 response measurements are used to show the existence of condensed water at the interface. It is shown that the use of a suitable coupling agent improves the adhesion. However, vacuoles at the interface can still be formed and these can cause a breakdown of the packaging. The use of thicker layers of encapsulant will only postpone this breakdown.

KW - ISFETs

KW - Packaging

U2 - 10.1016/0925-4005(94)01526-N

DO - 10.1016/0925-4005(94)01526-N

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VL - 23

SP - 17

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JO - Sensors and actuators. B: Chemical

JF - Sensors and actuators. B: Chemical

SN - 0925-4005

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