Characterization of 3D printed sheets using multi-frequency scanning impedance microscopy

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Abstract

In this work we present a multi-frequency scanning impedance microscopy technique suitable for 3D printed structures. In this technique, a ball-head pogo pin is used to measure the voltage distribution in 3D printed samples by rolling it over the sample. It is shown that this technique can be used to measure the complex electric field distribution at varying frequencies in a single layer 3D printed conductor
Original languageEnglish
Title of host publication2021 IEEE Sensors
ISBN (Electronic)978-1-7281-9501-8
DOIs
Publication statusPublished - 17 Dec 2021
EventIEEE SENSORS 2021 - Australia, Sydney, Australia
Duration: 31 Oct 20213 Nov 2021
https://2021.ieee-sensorsconference.org/

Conference

ConferenceIEEE SENSORS 2021
Country/TerritoryAustralia
CitySydney
Period31/10/213/11/21
Internet address

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