Characterization of Electrical Properties of Direct Ink Written Silver Ink

Heime Jonkers; Jelle Idzenga; Dimitrios Kosmas; Gijs Krijnen

doi:10.5162/SMSI2023/P68

Characterization of Electrical Properties of Direct Ink Written Silver Ink

Heime Jonkers, Jelle Idzenga, Dimitrios Kosmas, Gijs Krijnen

Robotics and Mechatronics

Research output: Contribution to conference › Paper › peer-review

Abstract

ilver-ink traces on top of thermoplastic polyurethane substrates produced by Fused- Filament-Fabrication were characterized in terms of electrical - and piezo resistivity. Low resistivity in the order of 52.8 μΩ cm was achieved with piezoresistive strain response being limited to strains below 1 % as a result of crack formation. Silver-ink traces are therefore deemed most suitable for interconnects.

Original language	English
Pages	412
Number of pages	413
DOIs	https://doi.org/10.5162/SMSI2023/P68
Publication status	Accepted/In press - 2023
Event	Sensor and Measurement Science International Conference, SMSI 2023 - Nürnberg, Germany Duration: 8 May 2023 → 11 May 2023 https://www.smsi-conference.com/

Conference

Conference	Sensor and Measurement Science International Conference, SMSI 2023
Abbreviated title	SMSI 2023germ
Country/Territory	Germany
City	Nürnberg
Period	8/05/23 → 11/05/23
Internet address	https://www.smsi-conference.com/

Keywords

3D printed Sensors
Fused Deposition Modeling
Direct-ink Writing
Silver Ink
Strain Gauge

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.5162/SMSI2023/P68

Cite this

@conference{f9db1534e9a74f34abaf65cb239253ee,

title = "Characterization of Electrical Properties of Direct Ink Written Silver Ink",

abstract = "ilver-ink traces on top of thermoplastic polyurethane substrates produced by Fused- Filament-Fabrication were characterized in terms of electrical - and piezo resistivity. Low resistivity in the order of 52.8 μΩ cm was achieved with piezoresistive strain response being limited to strains below 1 % as a result of crack formation. Silver-ink traces are therefore deemed most suitable for interconnects.",

keywords = "3D printed Sensors, Fused Deposition Modeling, Direct-ink Writing, Silver Ink, Strain Gauge",

author = "Heime Jonkers and Jelle Idzenga and Dimitrios Kosmas and Gijs Krijnen",

year = "2023",

doi = "10.5162/SMSI2023/P68",

language = "English",

pages = "412",

note = "Sensor and Measurement Science International Conference, SMSI 2023 , SMSI 2023germ ; Conference date: 08-05-2023 Through 11-05-2023",

url = "https://www.smsi-conference.com/",

}

TY - CONF

T1 - Characterization of Electrical Properties of Direct Ink Written Silver Ink

AU - Jonkers, Heime

AU - Idzenga, Jelle

AU - Kosmas, Dimitrios

AU - Krijnen, Gijs

PY - 2023

Y1 - 2023

N2 - ilver-ink traces on top of thermoplastic polyurethane substrates produced by Fused- Filament-Fabrication were characterized in terms of electrical - and piezo resistivity. Low resistivity in the order of 52.8 μΩ cm was achieved with piezoresistive strain response being limited to strains below 1 % as a result of crack formation. Silver-ink traces are therefore deemed most suitable for interconnects.

AB - ilver-ink traces on top of thermoplastic polyurethane substrates produced by Fused- Filament-Fabrication were characterized in terms of electrical - and piezo resistivity. Low resistivity in the order of 52.8 μΩ cm was achieved with piezoresistive strain response being limited to strains below 1 % as a result of crack formation. Silver-ink traces are therefore deemed most suitable for interconnects.

KW - 3D printed Sensors

KW - Fused Deposition Modeling

KW - Direct-ink Writing

KW - Silver Ink

KW - Strain Gauge

U2 - 10.5162/SMSI2023/P68

DO - 10.5162/SMSI2023/P68

M3 - Paper

SP - 412

T2 - Sensor and Measurement Science International Conference, SMSI 2023

Y2 - 8 May 2023 through 11 May 2023

ER -

Characterization of Electrical Properties of Direct Ink Written Silver Ink

Abstract

Conference

Keywords

UN SDGs

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Cite this