Abstract
This paper introduces characterization techniques to investigate electrical properties of 3D printed conductors. It presents a physical model to describe frequency dependent electrical properties of 3D-printed conductors; the use of infrared thermography to characterize electrical anisotropy in 3D-printed sheets and the use of the voltage contrast Scanning Electron Microscopy method (VCSEM) to determine potential distributions in 3D-printed sheets. The characterization methods could enable improvement of 3D-printed transducer design and exploit electrical properties of 3D-printed conductors.
Original language | English |
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Title of host publication | IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019 |
Publisher | IEEE |
ISBN (Electronic) | 9781538693049 |
DOIs | |
Publication status | Published - 8 Aug 2019 |
Event | 1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019 - Glasgow, United Kingdom Duration: 7 Jul 2019 → 10 Jul 2019 Conference number: 1 https://2019.ieee-fleps.org/ |
Conference
Conference | 1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019 |
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Abbreviated title | FLEPS 2019 |
Country/Territory | United Kingdom |
City | Glasgow |
Period | 7/07/19 → 10/07/19 |
Internet address |
Keywords
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