TY - JOUR
T1 - Click-and-Bond
T2 - Room-Temperature and Solvent-Free Bonding of Polymer-Based Microfluidic Devices
AU - Di Iorio, Daniele
AU - Rameshbabu, Sharath
AU - Bruijns, Brigitte
AU - Movilli, Jacopo
AU - Skolimowski, Maciej
AU - Huskens, Jurriaan
N1 - Funding Information:
The authors acknowledge the Nationaal Regieorgaan Praktijkgericht Onderzoek SIA and the Netherlands Organization for Scientific Research (NWO) for funding (projects GOCH.KrEM.KcC01.010 and TOP 715.015.001).
Publisher Copyright:
© 2022 The Authors. Advanced Materials Interfaces published by Wiley-VCH GmbH.
PY - 2022/8/11
Y1 - 2022/8/11
N2 - The production of a new class of microfluidic devices built from thermoplastic materials has recently aroused interest in a high-volume and cost-effective fabrication of sensing devices. During device formation, the bonding of two slides, one containing the microchannels and another used as a non-modified capping layer, is generally performed at high temperature, high pressure, and/or employing organic solvents. Such bonding procedures, however, are not compatible with the use of slides pre-functionalized with biomolecules. Here a low-temperature, UV-light-free, and solvent-free bonding method for polymeric devices, based on poly-l-lysine (PLL) polymers modified with click-chemistry moieties is presented. The advantages obtained from the use of PLL and the appended complementary click-chemistry groups enable a fast adsorption of polymers onto the substrates at room temperature, followed by a fast and stable bonding between two complementarily functionalized slides under mild conditions. Bonded fluidic devices show a resistance to high fluid pressures well above those needed for practical application. The optimal density (2–5%) of reactive groups appended to PLL is assessed using lap shear tests. The here developed method achieves bonding at low temperature, which promises fabrication of microfluidic devices functionalized with biomolecules prior to the sealing process, applicable to a wide range of polymeric materials.
AB - The production of a new class of microfluidic devices built from thermoplastic materials has recently aroused interest in a high-volume and cost-effective fabrication of sensing devices. During device formation, the bonding of two slides, one containing the microchannels and another used as a non-modified capping layer, is generally performed at high temperature, high pressure, and/or employing organic solvents. Such bonding procedures, however, are not compatible with the use of slides pre-functionalized with biomolecules. Here a low-temperature, UV-light-free, and solvent-free bonding method for polymeric devices, based on poly-l-lysine (PLL) polymers modified with click-chemistry moieties is presented. The advantages obtained from the use of PLL and the appended complementary click-chemistry groups enable a fast adsorption of polymers onto the substrates at room temperature, followed by a fast and stable bonding between two complementarily functionalized slides under mild conditions. Bonded fluidic devices show a resistance to high fluid pressures well above those needed for practical application. The optimal density (2–5%) of reactive groups appended to PLL is assessed using lap shear tests. The here developed method achieves bonding at low temperature, which promises fabrication of microfluidic devices functionalized with biomolecules prior to the sealing process, applicable to a wide range of polymeric materials.
KW - click chemistry
KW - cyclic olefin copolymer
KW - microfluidics
KW - poly- l-lysine
KW - room-temperature bonding of polymer devices
UR - http://www.scopus.com/inward/record.url?scp=85134018430&partnerID=8YFLogxK
U2 - 10.1002/admi.202200282
DO - 10.1002/admi.202200282
M3 - Article
AN - SCOPUS:85134018430
VL - 9
JO - Advanced materials interfaces
JF - Advanced materials interfaces
SN - 2196-7350
IS - 23
M1 - 2200282
ER -