CMOS post-processing for monolithic microsystems

Jurriaan Schmitz

CMOS post-processing for monolithic microsystems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

Abstract

The semiconductor industry is adjusting focus towards the so-called “More than Moore‿ innovation. By this is meant that microchip progress may not (or not only) follow from Moore’s Law and its resulting dimensional scaling, but can also come from the addition of new components, new layers and new functions inside the microchip itself. Examples are the introduction of passive RF components, biosensors, and 3D integration. This new innovation paradigm offers great opportunities for the field of microelectronics. Rather than the unidirectional scaling improvements of CMOS and memory technologies, leading to ever higher performance microprocessors and cheaper memory, diversification will lead to entirely new microsystems. Recent examples are the CMOS active pixel sensor, now embedded as cameras in many handheld consumer products, and human-implantable electronics for medical purposes.

Original language	Undefined
Title of host publication	Nano and Giga Challenges in Electronics, Photonics and Renewable Energy, Nano & Giga 2014
Place of Publication	Tempe, Arizona, USA
Publisher	Arizona State University
Pages	-
Number of pages	1
ISBN (Print)	not assigned
Publication status	Published - 11 Mar 2014
Event	Nano and Giga Challenges in Electronics, Photonics and Renewable Energy, Nano & Giga 2014 - Tempe, United States Duration: 10 Mar 2014 → 14 Mar 2014

Publication series

Name
Publisher	Arizona State University, Tempe, Arizona, USA

Conference

Conference	Nano and Giga Challenges in Electronics, Photonics and Renewable Energy, Nano & Giga 2014
Country	United States
City	Tempe
Period	10/03/14 → 14/03/14

Keywords

EWI-25072
METIS-306028
IR-91832

Access to Document

Cite this

Schmitz, J. (2014). CMOS post-processing for monolithic microsystems. In Nano and Giga Challenges in Electronics, Photonics and Renewable Energy, Nano & Giga 2014 (pp. -). Tempe, Arizona, USA: Arizona State University.

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AB - The semiconductor industry is adjusting focus towards the so-called “More than Moore‿ innovation. By this is meant that microchip progress may not (or not only) follow from Moore’s Law and its resulting dimensional scaling, but can also come from the addition of new components, new layers and new functions inside the microchip itself. Examples are the introduction of passive RF components, biosensors, and 3D integration. This new innovation paradigm offers great opportunities for the field of microelectronics. Rather than the unidirectional scaling improvements of CMOS and memory technologies, leading to ever higher performance microprocessors and cheaper memory, diversification will lead to entirely new microsystems. Recent examples are the CMOS active pixel sensor, now embedded as cameras in many handheld consumer products, and human-implantable electronics for medical purposes.

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