The semiconductor industry is adjusting focus towards the so-called “More than Moore‿ innovation. By this is meant that microchip progress may not (or not only) follow from Moore’s Law and its resulting dimensional scaling, but can also come from the addition of new components, new layers and new functions inside the microchip itself. Examples are the introduction of passive RF components, biosensors, and 3D integration.
This new innovation paradigm offers great opportunities for the field of microelectronics. Rather than the unidirectional scaling improvements of CMOS and memory technologies, leading to ever higher performance microprocessors and cheaper memory, diversification will lead to entirely new microsystems. Recent examples are the CMOS active pixel sensor, now embedded as cameras in many handheld consumer products, and human-implantable electronics for medical purposes.
|Publisher||Arizona State University, Tempe, Arizona, USA|
|Conference||Nano and Giga Challenges in Electronics, Photonics and Renewable Energy, Nano & Giga 2014|
|Period||10/03/14 → 14/03/14|