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Abstract
In this work, the authors developed hot-wire assisted atomic layer deposition (HWALD) to deposit tungsten (W) with a tungsten filament heated up to 1700–2000 C. Atomic hydrogen (at-H) was generated by dissociation of molecular hydrogen (H2), which reacted with WF6 at the substrate to deposit W. The growth behavior was monitored in real time by an in situ spectroscopic ellipsometer.
In this work, the authors compare samples with tungsten grown by either HWALD or chemical vapor deposition (CVD) in terms of growth kinetics and properties. For CVD, the samples were made in a mixture of WF6 and molecular or atomic hydrogen. Resistivity of the WF6-H2 CVD layers was 20 lXcm, whereas for the WF6-at-H-CVD layers, it was 28 lXcm. Interestingly, the resistivity was as high as 100 lXcm for the HWALD films, although the tungsten films were 99% pure according to x-ray photoelectron spectroscopy. X-ray diffraction reveals that the HWALD W was crystallized as b-W, whereas both CVD films were in the a-W phase.
Original language | English |
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Article number | 01A129 |
Number of pages | 10 |
Journal | Journal of vacuum science & technology A: vacuum, surfaces, and films |
Volume | 34 |
Issue number | 1 |
DOIs | |
Publication status | Published - Jan 2016 |
Keywords
- Chemical vapor deposition (CVD)
- Atomic layer deposition (ALD)
- Etching
- Tungsten
- Electrical resistivity
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Dive into the research topics of 'Comparison of tungsten films grown by CVD and hot-wire assisted atomic layer deposition in a cold-wall reactor'. Together they form a unique fingerprint.Activities
- 1 Oral presentation
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A comparison of tungsten films grown by CVD and hot-wire assisted ALD
Yang, M. (Speaker), Aarnink, A. A. I. (Contributor), Kovalgin, A. Y. (Contributor), Wolters, R. A. M. (Contributor) & Schmitz, J. (Speaker)
28 Jun 2015 → 1 Jul 2015Activity: Talk or presentation › Oral presentation