Contact chain measurements for ultrathin conducting films

A.W. Groenland; Robertus A.M. Wolters; Alexeij Y. Kovalgin; Jurriaan Schmitz

Contact chain measurements for ultrathin conducting films

A.W. Groenland, Robertus A.M. Wolters, Alexeij Y. Kovalgin, Jurriaan Schmitz

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

Abstract

Test structures for the electrical characterization of ultrathin conductive (ALD) films are presented based on electrodes on which the ultrathin film is deposited. The contact resistance of the buried electrodes to the ultrathin ALD TiN films is investigated using contact chain structures. This work includes test structure design and fabrication, and the electrical characterization of ALD TiN films down to 4 nm in thickness. It is shown that contact chain structures with buried electrodes can be used successfully to characterize the contact resistance to sub 10 nm ALD TiN films

Original language	Undefined
Title of host publication	Proceedings of the 12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors
Place of Publication	Utrecht, The Netherlands
Publisher	STW
Pages	150-152
Number of pages	3
ISBN (Print)	978-90-73461-62-8
Publication status	Published - 26 Nov 2009
Event	12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2009 - Veldhoven, Netherlands Duration: 26 Nov 2009 → 27 Nov 2009 Conference number: 12

Publication series

Name
Publisher	Technology Foundation STW

Conference

Conference	12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2009
Abbreviated title	SAFE
Country/Territory	Netherlands
City	Veldhoven
Period	26/11/09 → 27/11/09

Keywords

METIS-264270
Atomic Layer Deposition
Contact resistance
SC-ICS: Integrated Chemical Sensors
Titanium Nitride
Test structure
EWI-17062
IR-69054

Access to Document

http://eprints.eemcs.utwente.nl/secure2/17062/01/groenland.pdf

Cite this

@inproceedings{7a573c497c99446296385058f7053f85,

title = "Contact chain measurements for ultrathin conducting films",

abstract = "Test structures for the electrical characterization of ultrathin conductive (ALD) films are presented based on electrodes on which the ultrathin film is deposited. The contact resistance of the buried electrodes to the ultrathin ALD TiN films is investigated using contact chain structures. This work includes test structure design and fabrication, and the electrical characterization of ALD TiN films down to 4 nm in thickness. It is shown that contact chain structures with buried electrodes can be used successfully to characterize the contact resistance to sub 10 nm ALD TiN films",

keywords = "METIS-264270, Atomic Layer Deposition, Contact resistance, SC-ICS: Integrated Chemical Sensors, Titanium Nitride, Test structure, EWI-17062, IR-69054",

author = "A.W. Groenland and Wolters, {Robertus A.M.} and Kovalgin, {Alexeij Y.} and Jurriaan Schmitz",

year = "2009",

month = nov,

day = "26",

language = "Undefined",

isbn = "978-90-73461-62-8",

publisher = "STW",

pages = "150--152",

booktitle = "Proceedings of the 12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors",

note = "12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2009 ; Conference date: 26-11-2009 Through 27-11-2009",

}

Groenland, AW, Wolters, RAM, Kovalgin, AY & Schmitz, J 2009, Contact chain measurements for ultrathin conducting films. in Proceedings of the 12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors. STW, Utrecht, The Netherlands, pp. 150-152, 12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2009, Veldhoven, Netherlands, 26/11/09. <http://eprints.eemcs.utwente.nl/secure2/17062/01/groenland.pdf>

Contact chain measurements for ultrathin conducting films. / Groenland, A.W.; Wolters, Robertus A.M.; Kovalgin, Alexeij Y. et al.
Proceedings of the 12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors. Utrecht, The Netherlands: STW, 2009. p. 150-152.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic

TY - GEN

T1 - Contact chain measurements for ultrathin conducting films

AU - Groenland, A.W.

AU - Wolters, Robertus A.M.

AU - Kovalgin, Alexeij Y.

AU - Schmitz, Jurriaan

N1 - Conference code: 12

PY - 2009/11/26

Y1 - 2009/11/26

N2 - Test structures for the electrical characterization of ultrathin conductive (ALD) films are presented based on electrodes on which the ultrathin film is deposited. The contact resistance of the buried electrodes to the ultrathin ALD TiN films is investigated using contact chain structures. This work includes test structure design and fabrication, and the electrical characterization of ALD TiN films down to 4 nm in thickness. It is shown that contact chain structures with buried electrodes can be used successfully to characterize the contact resistance to sub 10 nm ALD TiN films

AB - Test structures for the electrical characterization of ultrathin conductive (ALD) films are presented based on electrodes on which the ultrathin film is deposited. The contact resistance of the buried electrodes to the ultrathin ALD TiN films is investigated using contact chain structures. This work includes test structure design and fabrication, and the electrical characterization of ALD TiN films down to 4 nm in thickness. It is shown that contact chain structures with buried electrodes can be used successfully to characterize the contact resistance to sub 10 nm ALD TiN films

KW - METIS-264270

KW - Atomic Layer Deposition

KW - Contact resistance

KW - SC-ICS: Integrated Chemical Sensors

KW - Titanium Nitride

KW - Test structure

KW - EWI-17062

KW - IR-69054

M3 - Conference contribution

SN - 978-90-73461-62-8

SP - 150

EP - 152

BT - Proceedings of the 12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors

PB - STW

CY - Utrecht, The Netherlands

T2 - 12th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2009

Y2 - 26 November 2009 through 27 November 2009

ER -