Copper Foam for Capillary Structures in Heat Pipes

Wessel Willems Wits

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationFirst International Conference on Computational Methods for Thermal Problems Thermacomp 2009
    EditorsN. Massarotti, P. Nithiarasu
    Place of PublicationNapoli, Italy
    Publisherniet bekend
    Pages277-280
    ISBN (Print)978-88-7431-459-1
    Publication statusPublished - 8 Sep 2009
    Event1st International Conference on Computational Methods for Thermal Problems, 2009 - Naples, Italy
    Duration: 8 Sep 200910 Sep 2009
    Conference number: 1

    Conference

    Conference1st International Conference on Computational Methods for Thermal Problems, 2009
    Abbreviated titleThermaComp 2009
    CountryItaly
    CityNaples
    Period8/09/0910/09/09

    Keywords

    • METIS-259409

    Cite this

    Wits, W. W. (2009). Copper Foam for Capillary Structures in Heat Pipes. In N. Massarotti, & P. Nithiarasu (Eds.), First International Conference on Computational Methods for Thermal Problems Thermacomp 2009 (pp. 277-280). Napoli, Italy: niet bekend.