Copper for Advance Interconnect

V. Nguyen Hoang, H. van Kranenburg, F. Weimar, P.H. Woerlee, A.J. Hof

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationThe Third International Workshop on Materials Science
    Place of PublicationHanoi, Vietnam
    Pages90-99
    Number of pages10
    Publication statusPublished - 2 Nov 1999

    Keywords

    • METIS-113902

    Cite this

    Nguyen Hoang, V., van Kranenburg, H., Weimar, F., Woerlee, P. H., & Hof, A. J. (1999). Copper for Advance Interconnect. In The Third International Workshop on Materials Science (pp. 90-99). Hanoi, Vietnam.
    Nguyen Hoang, V. ; van Kranenburg, H. ; Weimar, F. ; Woerlee, P.H. ; Hof, A.J. / Copper for Advance Interconnect. The Third International Workshop on Materials Science. Hanoi, Vietnam, 1999. pp. 90-99
    @inproceedings{9515ac569ae54b1ab8a0889de17c0c87,
    title = "Copper for Advance Interconnect",
    keywords = "METIS-113902",
    author = "{Nguyen Hoang}, V. and {van Kranenburg}, H. and F. Weimar and P.H. Woerlee and A.J. Hof",
    year = "1999",
    month = "11",
    day = "2",
    language = "Undefined",
    isbn = "90-5776-033-9",
    pages = "90--99",
    booktitle = "The Third International Workshop on Materials Science",

    }

    Nguyen Hoang, V, van Kranenburg, H, Weimar, F, Woerlee, PH & Hof, AJ 1999, Copper for Advance Interconnect. in The Third International Workshop on Materials Science. Hanoi, Vietnam, pp. 90-99.

    Copper for Advance Interconnect. / Nguyen Hoang, V.; van Kranenburg, H.; Weimar, F.; Woerlee, P.H.; Hof, A.J.

    The Third International Workshop on Materials Science. Hanoi, Vietnam, 1999. p. 90-99.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    TY - GEN

    T1 - Copper for Advance Interconnect

    AU - Nguyen Hoang, V.

    AU - van Kranenburg, H.

    AU - Weimar, F.

    AU - Woerlee, P.H.

    AU - Hof, A.J.

    PY - 1999/11/2

    Y1 - 1999/11/2

    KW - METIS-113902

    M3 - Conference contribution

    SN - 90-5776-033-9

    SP - 90

    EP - 99

    BT - The Third International Workshop on Materials Science

    CY - Hanoi, Vietnam

    ER -

    Nguyen Hoang V, van Kranenburg H, Weimar F, Woerlee PH, Hof AJ. Copper for Advance Interconnect. In The Third International Workshop on Materials Science. Hanoi, Vietnam. 1999. p. 90-99