Copper for Advance Interconnect

V. Nguyen Hoang, H. van Kranenburg, F. Weimar, P.H. Woerlee, A.J. Hof

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationThe Third International Workshop on Materials Science
    Place of PublicationHanoi, Vietnam
    Number of pages10
    Publication statusPublished - 2 Nov 1999


    • METIS-113902

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