Cracking and delamination of metal organic vapour deposited alumina and silica films

V.A.C. Haanappel, V.A.C. Haanappel, H.D. van Corbach, T. Fransen, P.J. Gellings

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Abstract

Amorphous alumina and silica films were deposited on AISI by thermal decomposition at atmospheric pressure of aluminium-tri-sec-butoxide and di-acetoxy-di-tertiary-butoxided-silane respectively. Above a critical coating thickness of the oxide films, cracking and delamination occurred during the deposition process. These were due to intrinsic rather than to thermal stresses. Cracking and delamination do not occurs simultaneously. The fracture toughness of the film, the substrate and the interface is an important factor. After delamination along the substrate-film interface, the films curled to scrolls, indicating stress. A complete explanation of the stress gradient formed in the film during the deposition process is not yet available.
Original languageUndefined
Pages (from-to)179-185
Number of pages7
JournalMaterials science and engineering
Volume1993
Issue number167
DOIs
Publication statusPublished - 1993

Keywords

  • METIS-105452
  • IR-10016

Cite this

Haanappel, V. A. C., Haanappel, V. A. C., van Corbach, H. D., Fransen, T., & Gellings, P. J. (1993). Cracking and delamination of metal organic vapour deposited alumina and silica films. Materials science and engineering, 1993(167), 179-185. https://doi.org/10.1016/0921-5093(93)90352-F