Amorphous alumina and silica films were deposited on AISI by thermal decomposition at atmospheric pressure of aluminium-tri-sec-butoxide and di-acetoxy-di-tertiary-butoxided-silane respectively. Above a critical coating thickness of the oxide films, cracking and delamination occurred during the deposition process. These were due to intrinsic rather than to thermal stresses. Cracking and delamination do not occurs simultaneously. The fracture toughness of the film, the substrate and the interface is an important factor. After delamination along the substrate-film interface, the films curled to scrolls, indicating stress. A complete explanation of the stress gradient formed in the film during the deposition process is not yet available.
Haanappel, V. A. C., Haanappel, V. A. C., van Corbach, H. D., Fransen, T., & Gellings, P. J. (1993). Cracking and delamination of metal organic vapour deposited alumina and silica films. Materials science and engineering, 1993(167), 179-185. https://doi.org/10.1016/0921-5093(93)90352-F