TY - GEN
T1 - Cross-bidge Kelvin resistor (CBKR) structures for measurement of low contact resistances
AU - Stavitski, N.
AU - Klootwijk, J.H.
AU - van Zeijl, H.W.
AU - Boksteen, B.K.
AU - Boksteen, B.K.
AU - Kovalgin, Alexeij Y.
AU - Wolters, Robertus A.M.
N1 - http://eprints.ewi.utwente.nl/11742
PY - 2007/11/29
Y1 - 2007/11/29
N2 - A convenient test structure for measurement of the specific contact resistance (�?c) of metal-semiconductor junctions is the CBKR structure. During last few decades the parasitic factors which may strongly affect the measurements accuracy for �?c < 10-6 Ω • cm2 have been sufficiently discussed and the minimum of the �?c to be measured using CBKR structures was estimated. We fabricated a set of CBKR structures with different geometries to confirm this limit experimentally. These structures were manufactured for metal-to-metal contacts. It was found that the extracted CBKR values were determined by dimensions of the two-metal stack in the contact area and sheet resistances of the metals used.
Index Terms—Contact resistance, cross-bridge Kelvin resistor (CBKR), sheet resistance, test structures, metal, silicon
AB - A convenient test structure for measurement of the specific contact resistance (�?c) of metal-semiconductor junctions is the CBKR structure. During last few decades the parasitic factors which may strongly affect the measurements accuracy for �?c < 10-6 Ω • cm2 have been sufficiently discussed and the minimum of the �?c to be measured using CBKR structures was estimated. We fabricated a set of CBKR structures with different geometries to confirm this limit experimentally. These structures were manufactured for metal-to-metal contacts. It was found that the extracted CBKR values were determined by dimensions of the two-metal stack in the contact area and sheet resistances of the metals used.
Index Terms—Contact resistance, cross-bridge Kelvin resistor (CBKR), sheet resistance, test structures, metal, silicon
KW - EWI-11742
KW - METIS-245949
KW - IR-64583
KW - SC-ICF: Integrated Circuit Fabrication
M3 - Conference contribution
SN - 978-90-73461-49-9
SP - 551
EP - 554
BT - 10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE)
PB - STW
CY - Utrecht, The Netherlands
T2 - 10th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2007
Y2 - 29 November 2007 through 30 November 2007
ER -