Curved layer fused deposition modeling in conductive polymer additive manufacturing

Olaf Diegel*, Sarat Singamneni, Ben Huang, Ian Gibson

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

12 Citations (Scopus)

Abstract

This paper describes a curved-layer additive manufacturing technology that has the potential to print plastic components with integral conductive polymer electronic circuits. Researchers at AUT University in New Zealand and the National University of Singapore have developed a novel Fused Deposition Modeling (FDM) process in which the layers of material that make up the part are deposited as curved layers instead of the conventional flat layers. This technology opens up possibilities of building curved plastic parts that have conductive electronic tracks and components printed as an integral part of the plastic component, thereby eliminating printed circuit boards and wiring. It is not possible to do this with existing flat-layer additive manufacturing technologies as the continuity of a circuit could be interrupted between the layers. With curved-layer fused deposition modeling (CLFDM) this problem is removed as continuous filaments in 3 dimensions can be produced, allowing for continuous conductive circuits.

Original languageEnglish
Title of host publicationAdvances in Mechanical Design
Pages1984-1987
Number of pages4
DOIs
Publication statusPublished - 2011
Externally publishedYes
Event2nd International Conference on Manufacturing Science and Engineering, ICMSE 2011 - Guilin, China
Duration: 9 Apr 201111 Apr 2011
Conference number: 2

Publication series

NameAdvanced Materials Research
Volume199-200
ISSN (Print)1022-6680

Conference

Conference2nd International Conference on Manufacturing Science and Engineering, ICMSE 2011
Abbreviated titleICMSE 2011
CountryChina
CityGuilin
Period9/04/1111/04/11

Keywords

  • Additive manufacturing
  • Conductive 3D printing
  • Curved layer fused deposition modeling

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