Dealing with Leakage Current in TLM and CTLM Structures with Vertical Junction Isolation

Svetlana N. Bystrova, Sander M. Smits, Johan H. Klootwijk, Rob A.M. Wolters, Alexey Y. Kovalgin, Lis K. Nanver, Jurriaan Schmitz

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    2 Citations (Scopus)
    41 Downloads (Pure)

    Abstract

    Transmission line method (TLM) structures are often employed to extract contact resistivity between a metal and a doped semiconductor region. In this article we treat the situation where the doped region is junction-isolated from the substrate. The junction isolation may be leaky resulting in erroneous parameter extraction. The effect of junction leakage is treated both theoretically and through exemplary wafer-level CTLM measurement results on photovoltaic cells (solar cells) and epi-wafer samples. This paper describes how reliable contact resistivity values can be obtained using the transmission line method on junction isolated structures.
    Original languageEnglish
    Title of host publication2017 International Conference of Microelectronic Test Structures (ICMTS)
    Place of PublicationPiscataway, NJ
    PublisherIEEE
    Pages1
    Number of pages6
    ISBN (Electronic)978-1-5090-3615-8
    ISBN (Print)978-1-5090-3616-5
    DOIs
    Publication statusPublished - 28 Mar 2017
    Event30th International conference on Microelectronic Test Structures, ICMTS 2017 - Maison Minatec, Grenoble, France
    Duration: 28 Mar 201730 Mar 2017
    Conference number: 30
    http://icmts2017.insight-outside.fr/
    http://www.homepages.ed.ac.uk/ajw/ICMTS/prog17.pdf

    Publication series

    NameInternational Conference of Microelectronic Test Structures (ICMTS)
    PublisherIEEE
    Volume2017
    ISSN (Electronic)2158-1029

    Conference

    Conference30th International conference on Microelectronic Test Structures, ICMTS 2017
    Abbreviated titleICMTS
    Country/TerritoryFrance
    CityGrenoble
    Period28/03/1730/03/17
    Internet address

    Keywords

    • 2023 OA procedure

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