Defect-Oriented Testing of an RSFQ D-type Flip-Flop

    Research output: Contribution to conferencePaper

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    Abstract

    Even though superconductor electronics is capable of handling the requirements for efficient high-speed devices in telecommunication and computing, the yield is very low compared to semiconductor processes. A structured test methodology has to be developed to improve the low yield in Superconductor Electronics (SCE). We have conducted studies on a Low-Temperature Superconductor (LTS) process and have developed test structures for the detection of random defects occurring in the process. We have implemented test-routines for semi-automatic testing of processed chips for structural defects at room temperature. In this paper, we present the details of the conducted tests on those test structures and associated measurement results. One of the defects, a crack in the superconducting wire is then further analysed to study its influence on an Rapid Single Flux Quantum (RSFQ) D-type Flip-Flop.
    Original languageUndefined
    Pages415-420
    Publication statusPublished - 2004
    Event15th Annual Workshop on Circuits, Systems and Signal Processing, ProRisc 2004 - Veldhoven, Netherlands
    Duration: 25 Nov 200426 Nov 2004
    Conference number: 15

    Conference

    Conference15th Annual Workshop on Circuits, Systems and Signal Processing, ProRisc 2004
    Abbreviated titleProRisc
    CountryNetherlands
    CityVeldhoven
    Period25/11/0426/11/04

    Keywords

    • IR-59472

    Cite this

    Arun, A. J., Weusthof, M. H. H., & Kerkhoff, H. G. (2004). Defect-Oriented Testing of an RSFQ D-type Flip-Flop. 415-420. Paper presented at 15th Annual Workshop on Circuits, Systems and Signal Processing, ProRisc 2004, Veldhoven, Netherlands.
    Arun, A.J. ; Weusthof, Marcel H.H. ; Kerkhoff, Hans G. / Defect-Oriented Testing of an RSFQ D-type Flip-Flop. Paper presented at 15th Annual Workshop on Circuits, Systems and Signal Processing, ProRisc 2004, Veldhoven, Netherlands.
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    year = "2004",
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    pages = "415--420",
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    Arun, AJ, Weusthof, MHH & Kerkhoff, HG 2004, 'Defect-Oriented Testing of an RSFQ D-type Flip-Flop' Paper presented at 15th Annual Workshop on Circuits, Systems and Signal Processing, ProRisc 2004, Veldhoven, Netherlands, 25/11/04 - 26/11/04, pp. 415-420.

    Defect-Oriented Testing of an RSFQ D-type Flip-Flop. / Arun, A.J.; Weusthof, Marcel H.H.; Kerkhoff, Hans G.

    2004. 415-420 Paper presented at 15th Annual Workshop on Circuits, Systems and Signal Processing, ProRisc 2004, Veldhoven, Netherlands.

    Research output: Contribution to conferencePaper

    TY - CONF

    T1 - Defect-Oriented Testing of an RSFQ D-type Flip-Flop

    AU - Arun, A.J.

    AU - Weusthof, Marcel H.H.

    AU - Kerkhoff, Hans G.

    PY - 2004

    Y1 - 2004

    N2 - Even though superconductor electronics is capable of handling the requirements for efficient high-speed devices in telecommunication and computing, the yield is very low compared to semiconductor processes. A structured test methodology has to be developed to improve the low yield in Superconductor Electronics (SCE). We have conducted studies on a Low-Temperature Superconductor (LTS) process and have developed test structures for the detection of random defects occurring in the process. We have implemented test-routines for semi-automatic testing of processed chips for structural defects at room temperature. In this paper, we present the details of the conducted tests on those test structures and associated measurement results. One of the defects, a crack in the superconducting wire is then further analysed to study its influence on an Rapid Single Flux Quantum (RSFQ) D-type Flip-Flop.

    AB - Even though superconductor electronics is capable of handling the requirements for efficient high-speed devices in telecommunication and computing, the yield is very low compared to semiconductor processes. A structured test methodology has to be developed to improve the low yield in Superconductor Electronics (SCE). We have conducted studies on a Low-Temperature Superconductor (LTS) process and have developed test structures for the detection of random defects occurring in the process. We have implemented test-routines for semi-automatic testing of processed chips for structural defects at room temperature. In this paper, we present the details of the conducted tests on those test structures and associated measurement results. One of the defects, a crack in the superconducting wire is then further analysed to study its influence on an Rapid Single Flux Quantum (RSFQ) D-type Flip-Flop.

    KW - IR-59472

    M3 - Paper

    SP - 415

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    ER -

    Arun AJ, Weusthof MHH, Kerkhoff HG. Defect-Oriented Testing of an RSFQ D-type Flip-Flop. 2004. Paper presented at 15th Annual Workshop on Circuits, Systems and Signal Processing, ProRisc 2004, Veldhoven, Netherlands.