Dependency of Dishing on Polish Time and Slurry Chemistry in Cu-CMP

V. Nguyen Hoang, H. van Kranenburg, P.H. Woerlee

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    Original languageUndefined
    Title of host publicationEuropean Workshop Materials for Advanced Metallization
    Place of PublicationOostende, Belgium
    Pages164-165
    Number of pages2
    Publication statusPublished - 8 Mar 1999

    Keywords

    • METIS-113904

    Cite this

    Nguyen Hoang, V., van Kranenburg, H., & Woerlee, P. H. (1999). Dependency of Dishing on Polish Time and Slurry Chemistry in Cu-CMP. In European Workshop Materials for Advanced Metallization (pp. 164-165). Oostende, Belgium.