Deposition and detection of particles during integrated circuit manufacturing

Faisal Wali, D. Martin Knotter, John J. Kelly, F.G. Kuper

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademic

    Abstract

    Abstract—Deposition mechanism of silica particles on silicon wafers was investigated by depositing specially prepared mono-dispersed particles (mean diameter = 330 nm). To measure particles of the size below the detection limit of our particle measurement tools, silica particles with luminance core were prepared. Three phenomena of deposition were discerned: sedimentation (diffusion driven), printing due to hydrodynamic forces at gas-solid-liquid interface, and dry in of carry-over layer.
    Original languageEnglish
    Title of host publicationProceedings of the 9th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors 2006
    Subtitle of host publicationNovember 23-24, 2006, Veldhoven, the Netherlands
    Place of PublicationUtrecht, The Netherlands
    PublisherSTW
    Pages483-487
    Number of pages5
    ISBN (Print)90-73461-44-8
    Publication statusPublished - 27 Nov 2006
    Event9th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2006 - Veldhoven, Netherlands
    Duration: 23 Nov 200624 Nov 2006
    Conference number: 9

    Workshop

    Workshop9th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors, SAFE 2006
    CountryNetherlands
    CityVeldhoven
    Period23/11/0624/11/06

    Keywords

    • SC-ICRY: Integrated Circuit Reliability and Yield

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