TY - JOUR
T1 - Deposition of Ureido and Methacrylate Functionalities Onto Silica Nanoparticles and its Effect on the Properties of Polypropylene-Based Nanodielectrics
AU - Mahtabani, Amirhossein
AU - Niittymäki, Minna
AU - Anyszka, Rafal
AU - Rytöluoto, Ilkka
AU - He, Xiaozhen
AU - Saarimäki, Eetta
AU - Lahti, Kari
AU - Paajanen, Mika
AU - Dierkes, Wilma
AU - Blume, Anke
N1 - Funding Information:
This work was supported by European Union’s Horizon 2020 Research and Innovation Program under Grant 720858.
Funding Information:
This work was supported by European Union's Horizon 2020 Research and Innovation Program under Grant 720858.
Publisher Copyright:
© 2013 IEEE.
Financial transaction number:
2500014369
PY - 2021/9/14
Y1 - 2021/9/14
N2 - Surface modification of nanoparticles is often utilized to tailor the interfacial properties in dielectric nanocomposites. Introducing different functional groups to the nanoparticles' surface may induce localized states (traps) that can enhance the dielectric performance of the material depending on their density and energy levels. Furthermore, surface modification of the filler can affect the dispersion quality and crystallization of the nanocomposites which can ultimately alter the dielectric response of the material. In this study, functionalization of silica nanoparticles is demonstrated using 3-(trimethoxysilyl)propyl methacrylate (TMPM) and 1-[3-(trimethoxysilyl)propyl]urea (TMPU) as modifying agents. The effect of such modifications on the crystallization behavior, dispersion quality of the nanoparticles, as well as charge trapping and transport under a medium DC field is studied in nanocomposites based on polypropylene (PP)/ethylene-octene-copolymer (EOC) blends at 1% and 5% of filler concentrations. The results show that both ureido and methacrylate functional groups introduce localized states, but with different energy levels. Nitrogen containing ureido groups in TMPU tend to introduce deeper traps to the filler-polymer interfaces, compared to the methacrylate silane modification. Comparing the two types of surface functionalization, the ureido-functionalized silica resulted in a suppression of space charge formation at the interfaces under a medium DC electric field, despite the relatively larger mean cluster size of nanoparticles.
AB - Surface modification of nanoparticles is often utilized to tailor the interfacial properties in dielectric nanocomposites. Introducing different functional groups to the nanoparticles' surface may induce localized states (traps) that can enhance the dielectric performance of the material depending on their density and energy levels. Furthermore, surface modification of the filler can affect the dispersion quality and crystallization of the nanocomposites which can ultimately alter the dielectric response of the material. In this study, functionalization of silica nanoparticles is demonstrated using 3-(trimethoxysilyl)propyl methacrylate (TMPM) and 1-[3-(trimethoxysilyl)propyl]urea (TMPU) as modifying agents. The effect of such modifications on the crystallization behavior, dispersion quality of the nanoparticles, as well as charge trapping and transport under a medium DC field is studied in nanocomposites based on polypropylene (PP)/ethylene-octene-copolymer (EOC) blends at 1% and 5% of filler concentrations. The results show that both ureido and methacrylate functional groups introduce localized states, but with different energy levels. Nitrogen containing ureido groups in TMPU tend to introduce deeper traps to the filler-polymer interfaces, compared to the methacrylate silane modification. Comparing the two types of surface functionalization, the ureido-functionalized silica resulted in a suppression of space charge formation at the interfaces under a medium DC electric field, despite the relatively larger mean cluster size of nanoparticles.
KW - dielectrics
KW - electrical properties
KW - HVDC
KW - insulation materials
KW - nanocomposites
KW - silica nanoparticles
KW - Surface functionalization
KW - UT-Gold-D
UR - http://www.scopus.com/inward/record.url?scp=85115160584&partnerID=8YFLogxK
U2 - 10.1109/ACCESS.2021.3112849
DO - 10.1109/ACCESS.2021.3112849
M3 - Article
AN - SCOPUS:85115160584
SN - 2169-3536
VL - 9
SP - 130340
EP - 130352
JO - IEEE Access
JF - IEEE Access
ER -