Design and fabrication of adiabatic vertical couplers for hybrid integration by flip-chip bonding

Jinfeng Mu, Mustafa Sefünç, Bojian Xu, Mindert Dijkstra, Sonia Maria García Blanco

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publicationSPIE Proceedings vol 9750, Integrated Optics: Devices, Materials, and Technologies XX 975012
EditorsJean-Emmanuel Broquin, Gualtiero Nunzi Conti
Place of PublicationSan Francisco, CA, USA
Pages975012-1-975012-10
DOIs
Publication statusPublished - 13 Feb 2016

Publication series

Name
Volume9750

Keywords

  • METIS-320507

Cite this

Mu, J., Sefünç, M., Xu, B., Dijkstra, M., & García Blanco, S. M. (2016). Design and fabrication of adiabatic vertical couplers for hybrid integration by flip-chip bonding. In J-E. Broquin, & G. N. Conti (Eds.), SPIE Proceedings vol 9750, Integrated Optics: Devices, Materials, and Technologies XX 975012 (pp. 975012-1-975012-10). San Francisco, CA, USA. https://doi.org/10.1117/12.2212206