Design and fabrication of adiabatic vertical couplers for hybrid integration by flip-chip bonding

Jinfeng Mu; Mustafa Sefünç; Bojian Xu; Mindert Dijkstra; Sonia Maria García Blanco

doi:10.1117/12.2212206

Design and fabrication of adiabatic vertical couplers for hybrid integration by flip-chip bonding

Jinfeng Mu, Mustafa Sefünç, Bojian Xu, Mindert Dijkstra, Sonia Maria García Blanco

Optical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

Original language	English
Title of host publication	SPIE Proceedings vol 9750, Integrated Optics: Devices, Materials, and Technologies XX 975012
Editors	Jean-Emmanuel Broquin, Gualtiero Nunzi Conti
Place of Publication	San Francisco, CA, USA
Pages	975012-1-975012-10
DOIs	https://doi.org/10.1117/12.2212206
Publication status	Published - 13 Feb 2016
Event	Integrated Optics: Devices, Materials, and Technologies XX: SPIE Proceedings vol 9750, Integrated Optics: Devices, Materials, and Technologies XX 975012 - San Francisco, CA, USA Duration: 13 Feb 2016 → …

Publication series

Name
Volume	9750

Conference

Conference	Integrated Optics: Devices, Materials, and Technologies XX
City	San Francisco, CA, USA
Period	13/02/16 → …

Keywords

METIS-320507

Access to Document

10.1117/12.2212206

Cite this

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title = "Design and fabrication of adiabatic vertical couplers for hybrid integration by flip-chip bonding",

keywords = "METIS-320507",

author = "Jinfeng Mu and Mustafa Sef{\"u}n{\c c} and Bojian Xu and Mindert Dijkstra and {Garc{\'i}a Blanco}, {Sonia Maria}",

year = "2016",

month = feb,

day = "13",

doi = "10.1117/12.2212206",

language = "English",

pages = "975012--1--975012--10",

editor = "Jean-Emmanuel Broquin and Conti, {Gualtiero Nunzi}",

booktitle = "SPIE Proceedings vol 9750, Integrated Optics: Devices, Materials, and Technologies XX 975012",

note = "Integrated Optics: Devices, Materials, and Technologies XX : SPIE Proceedings vol 9750, Integrated Optics: Devices, Materials, and Technologies XX 975012 ; Conference date: 13-02-2016",

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Mu, J, Sefünç, M, Xu, B, Dijkstra, M & García Blanco, SM 2016, Design and fabrication of adiabatic vertical couplers for hybrid integration by flip-chip bonding. in J-E Broquin & GN Conti (eds), SPIE Proceedings vol 9750, Integrated Optics: Devices, Materials, and Technologies XX 975012. San Francisco, CA, USA, pp. 975012-1-975012-10, Integrated Optics: Devices, Materials, and Technologies XX, San Francisco, CA, USA, 13/02/16. https://doi.org/10.1117/12.2212206

Design and fabrication of adiabatic vertical couplers for hybrid integration by flip-chip bonding. / Mu, Jinfeng; Sefünç, Mustafa; Xu, Bojian et al.
SPIE Proceedings vol 9750, Integrated Optics: Devices, Materials, and Technologies XX 975012. ed. / Jean-Emmanuel Broquin; Gualtiero Nunzi Conti. San Francisco, CA, USA, 2016. p. 975012-1-975012-10.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Design and fabrication of adiabatic vertical couplers for hybrid integration by flip-chip bonding

AU - Mu, Jinfeng

AU - Sefünç, Mustafa

AU - Xu, Bojian

AU - Dijkstra, Mindert

AU - García Blanco, Sonia Maria

PY - 2016/2/13

Y1 - 2016/2/13

KW - METIS-320507

U2 - 10.1117/12.2212206

DO - 10.1117/12.2212206

M3 - Conference contribution

SP - 975012-1-975012-10

BT - SPIE Proceedings vol 9750, Integrated Optics: Devices, Materials, and Technologies XX 975012

A2 - Broquin, Jean-Emmanuel

A2 - Conti, Gualtiero Nunzi

CY - San Francisco, CA, USA

T2 - Integrated Optics: Devices, Materials, and Technologies XX

Y2 - 13 February 2016

ER -