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Design and optimization of a 3-DOF planar MEMS stage with integrated thermal position sensors

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Abstract

This work presents the design and optimization of a large stroke planar positioning stage in a single-mask MEMS fabrication process. Electrostatic comb-drive actuators were used to control the position and rotation of the 3-DOF stage. Thermal displacement sensors are integrated to provide feedback. Simulations show that we are able to reach a +/-120mm range of motion and +/-30 degrees of rotation. Preliminary measurements were performed which validated our models.
Original languageEnglish
Title of host publicationProceedings of the 13th EUSPEN International Conference, Berlin, 27-31 May 2013, vol. 1
Place of PublicationBerlin, Germany
PublisherEUSPEN
Pages322-325
ISBN (Print)978-0-9566790-2-4
Publication statusPublished - 27 May 2013
Event13th EUSPEN International Conference 2013 - Maritim Hotel, Berlin, Germany
Duration: 27 May 201331 May 2013
Conference number: 13

Publication series

Name
PublisherEUSPEN

Conference

Conference13th EUSPEN International Conference 2013
Abbreviated titleEUSPEN
Country/TerritoryGermany
CityBerlin
Period27/05/1331/05/13

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 3 - Good Health and Well-being
    SDG 3 Good Health and Well-being

Keywords

  • IR-89598
  • METIS-301842

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