Design and realisation of a quasi monolithic silicon load cell

H. Wensink; Remco J. Wiegerink; A.F. Zwijze; Meint J. de Boer; Michael Curt Elwenspoek

Design and realisation of a quasi monolithic silicon load cell

H. Wensink, Remco J. Wiegerink, A.F. Zwijze, Meint J. de Boer, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

In this paper, the first silicon load cell is presented designed for measuring a load up to 1000 kg. A prototype has been realised. An improved cryogenic RIE process with high aspect ratio was developed for the fabrication of thin springs. Low temperature silicon direct bonding was used for the final assembly. The mechanical structure was tested using poly silicon strain gauges. Encapsulated resonant strain gauges [1] will be used in the final design in order to obtain the desired accuracy of 0.03%.

Original language	Undefined
Title of host publication	Proceedings of the Micromechanics Europe 1998 Conference (MME)
Place of Publication	Ulvik, Norway
Pages	190-193
Publication status	Published - 3 Jun 1998
Event	9th Micromechanics Europe Workshop, MME 1998 - Ulvik, Norway Duration: 3 Jun 1998 → 5 Jun 1998 Conference number: 9

Conference

Conference	9th Micromechanics Europe Workshop, MME 1998
Abbreviated title	MME
Country	Norway
City	Ulvik
Period	3/06/98 → 5/06/98

Keywords

IR-25570
METIS-130372

Access to Document

mme1998
open

Cite this

@inproceedings{7077b3f438d54a97900d4e57da1dd6a7,

title = "Design and realisation of a quasi monolithic silicon load cell",

abstract = "In this paper, the first silicon load cell is presented designed for measuring a load up to 1000 kg. A prototype has been realised. An improved cryogenic RIE process with high aspect ratio was developed for the fabrication of thin springs. Low temperature silicon direct bonding was used for the final assembly. The mechanical structure was tested using poly silicon strain gauges. Encapsulated resonant strain gauges [1] will be used in the final design in order to obtain the desired accuracy of 0.03%.",

keywords = "IR-25570, METIS-130372",

author = "H. Wensink and Wiegerink, {Remco J.} and A.F. Zwijze and {de Boer}, {Meint J.} and Elwenspoek, {Michael Curt}",

year = "1998",

month = jun,

day = "3",

language = "Undefined",

pages = "190--193",

booktitle = "Proceedings of the Micromechanics Europe 1998 Conference (MME)",

note = "null ; Conference date: 03-06-1998 Through 05-06-1998",

}

Design and realisation of a quasi monolithic silicon load cell. / Wensink, H.; Wiegerink, Remco J.; Zwijze, A.F.; de Boer, Meint J.; Elwenspoek, Michael Curt.

Proceedings of the Micromechanics Europe 1998 Conference (MME). Ulvik, Norway, 1998. p. 190-193.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Design and realisation of a quasi monolithic silicon load cell

AU - Wensink, H.

AU - Wiegerink, Remco J.

AU - Zwijze, A.F.

AU - de Boer, Meint J.

AU - Elwenspoek, Michael Curt

N1 - Conference code: 9

PY - 1998/6/3

Y1 - 1998/6/3

N2 - In this paper, the first silicon load cell is presented designed for measuring a load up to 1000 kg. A prototype has been realised. An improved cryogenic RIE process with high aspect ratio was developed for the fabrication of thin springs. Low temperature silicon direct bonding was used for the final assembly. The mechanical structure was tested using poly silicon strain gauges. Encapsulated resonant strain gauges [1] will be used in the final design in order to obtain the desired accuracy of 0.03%.

AB - In this paper, the first silicon load cell is presented designed for measuring a load up to 1000 kg. A prototype has been realised. An improved cryogenic RIE process with high aspect ratio was developed for the fabrication of thin springs. Low temperature silicon direct bonding was used for the final assembly. The mechanical structure was tested using poly silicon strain gauges. Encapsulated resonant strain gauges [1] will be used in the final design in order to obtain the desired accuracy of 0.03%.

KW - IR-25570

KW - METIS-130372

M3 - Conference contribution

SP - 190

EP - 193

BT - Proceedings of the Micromechanics Europe 1998 Conference (MME)

CY - Ulvik, Norway

Y2 - 3 June 1998 through 5 June 1998

ER -