Development of a solder bump technique for contacting a three-dimensional multi electrode array

T.A. Frieswijk, T.A. Frieswijk, J.A. Bielen, J.A. Bielen, Wim Rutten, Piet Bergveld

    Research output: Contribution to journalArticleAcademicpeer-review

    3 Citations (Scopus)
    42 Downloads (Pure)

    Abstract

    The application of a solder bump technique for contacting a three-dimensional multi electrode array is presented. Solder bumping (or C4: Controlled Collapse Chip Connections, also called Flip Chip contacting) is the most suitable contacting technique available for small dimensions and large numbers of connections. Techniques adapted from the literature could successfully be scaled down to be used for 55x55 μm pads at 120 μm heart-to-heart spacing, yielding well-conducting, reasonably strong bonds.
    Original languageUndefined
    Pages (from-to)48-52
    Number of pages5
    JournalMicrosystem technologies
    Volume3
    Issue number2
    DOIs
    Publication statusPublished - 1997

    Keywords

    • METIS-112270
    • IR-85583

    Cite this

    Frieswijk, T. A., Frieswijk, T. A., Bielen, J. A., Bielen, J. A., Rutten, W., & Bergveld, P. (1997). Development of a solder bump technique for contacting a three-dimensional multi electrode array. Microsystem technologies, 3(2), 48-52. https://doi.org/10.1007/s005420050054
    Frieswijk, T.A. ; Frieswijk, T.A. ; Bielen, J.A. ; Bielen, J.A. ; Rutten, Wim ; Bergveld, Piet. / Development of a solder bump technique for contacting a three-dimensional multi electrode array. In: Microsystem technologies. 1997 ; Vol. 3, No. 2. pp. 48-52.
    @article{c47e889a51364fe6bc7d41a957d40d65,
    title = "Development of a solder bump technique for contacting a three-dimensional multi electrode array",
    abstract = "The application of a solder bump technique for contacting a three-dimensional multi electrode array is presented. Solder bumping (or C4: Controlled Collapse Chip Connections, also called Flip Chip contacting) is the most suitable contacting technique available for small dimensions and large numbers of connections. Techniques adapted from the literature could successfully be scaled down to be used for 55x55 μm pads at 120 μm heart-to-heart spacing, yielding well-conducting, reasonably strong bonds.",
    keywords = "METIS-112270, IR-85583",
    author = "T.A. Frieswijk and T.A. Frieswijk and J.A. Bielen and J.A. Bielen and Wim Rutten and Piet Bergveld",
    year = "1997",
    doi = "10.1007/s005420050054",
    language = "Undefined",
    volume = "3",
    pages = "48--52",
    journal = "Microsystem technologies",
    issn = "0946-7076",
    publisher = "Springer",
    number = "2",

    }

    Frieswijk, TA, Frieswijk, TA, Bielen, JA, Bielen, JA, Rutten, W & Bergveld, P 1997, 'Development of a solder bump technique for contacting a three-dimensional multi electrode array', Microsystem technologies, vol. 3, no. 2, pp. 48-52. https://doi.org/10.1007/s005420050054

    Development of a solder bump technique for contacting a three-dimensional multi electrode array. / Frieswijk, T.A.; Frieswijk, T.A.; Bielen, J.A.; Bielen, J.A.; Rutten, Wim; Bergveld, Piet.

    In: Microsystem technologies, Vol. 3, No. 2, 1997, p. 48-52.

    Research output: Contribution to journalArticleAcademicpeer-review

    TY - JOUR

    T1 - Development of a solder bump technique for contacting a three-dimensional multi electrode array

    AU - Frieswijk, T.A.

    AU - Frieswijk, T.A.

    AU - Bielen, J.A.

    AU - Bielen, J.A.

    AU - Rutten, Wim

    AU - Bergveld, Piet

    PY - 1997

    Y1 - 1997

    N2 - The application of a solder bump technique for contacting a three-dimensional multi electrode array is presented. Solder bumping (or C4: Controlled Collapse Chip Connections, also called Flip Chip contacting) is the most suitable contacting technique available for small dimensions and large numbers of connections. Techniques adapted from the literature could successfully be scaled down to be used for 55x55 μm pads at 120 μm heart-to-heart spacing, yielding well-conducting, reasonably strong bonds.

    AB - The application of a solder bump technique for contacting a three-dimensional multi electrode array is presented. Solder bumping (or C4: Controlled Collapse Chip Connections, also called Flip Chip contacting) is the most suitable contacting technique available for small dimensions and large numbers of connections. Techniques adapted from the literature could successfully be scaled down to be used for 55x55 μm pads at 120 μm heart-to-heart spacing, yielding well-conducting, reasonably strong bonds.

    KW - METIS-112270

    KW - IR-85583

    U2 - 10.1007/s005420050054

    DO - 10.1007/s005420050054

    M3 - Article

    VL - 3

    SP - 48

    EP - 52

    JO - Microsystem technologies

    JF - Microsystem technologies

    SN - 0946-7076

    IS - 2

    ER -