Development of a solderbump technique for contacting a three-dimensional multi electrode array

T.A. Frieswijk, T.A. Frieswijk, J.A. Bielen, J.A. Bielen, Wim Rutten

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Abstract

The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacing
Original languageUndefined
Title of host publicationProceedings 17th Annual International Conference of the IEEE EMBS
Place of PublicationMontreal, Canada
PublisherIEEE
Pages-
Number of pages2
ISBN (Print)CD-ROM 0-7803-2
DOIs
Publication statusPublished - 20 Sep 1995
Event30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2008 - Vancouver, Canada
Duration: 20 Aug 200825 Aug 2008
Conference number: 30

Publication series

Name
PublisherIEEE
Volume2

Conference

Conference30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2008
Abbreviated titleEMBC
CountryCanada
CityVancouver
Period20/08/0825/08/08

Keywords

  • METIS-114238
  • IR-17343

Cite this

Frieswijk, T. A., Frieswijk, T. A., Bielen, J. A., Bielen, J. A., & Rutten, W. (1995). Development of a solderbump technique for contacting a three-dimensional multi electrode array. In Proceedings 17th Annual International Conference of the IEEE EMBS (pp. -). Montreal, Canada: IEEE. https://doi.org/10.1109/IEMBS.1995.579531
Frieswijk, T.A. ; Frieswijk, T.A. ; Bielen, J.A. ; Bielen, J.A. ; Rutten, Wim. / Development of a solderbump technique for contacting a three-dimensional multi electrode array. Proceedings 17th Annual International Conference of the IEEE EMBS. Montreal, Canada : IEEE, 1995. pp. -
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abstract = "The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacing",
keywords = "METIS-114238, IR-17343",
author = "T.A. Frieswijk and T.A. Frieswijk and J.A. Bielen and J.A. Bielen and Wim Rutten",
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Frieswijk, TA, Frieswijk, TA, Bielen, JA, Bielen, JA & Rutten, W 1995, Development of a solderbump technique for contacting a three-dimensional multi electrode array. in Proceedings 17th Annual International Conference of the IEEE EMBS. IEEE, Montreal, Canada, pp. -, 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2008, Vancouver, Canada, 20/08/08. https://doi.org/10.1109/IEMBS.1995.579531

Development of a solderbump technique for contacting a three-dimensional multi electrode array. / Frieswijk, T.A.; Frieswijk, T.A.; Bielen, J.A.; Bielen, J.A.; Rutten, Wim.

Proceedings 17th Annual International Conference of the IEEE EMBS. Montreal, Canada : IEEE, 1995. p. -.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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T1 - Development of a solderbump technique for contacting a three-dimensional multi electrode array

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AU - Bielen, J.A.

AU - Rutten, Wim

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N2 - The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacing

AB - The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacing

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KW - IR-17343

U2 - 10.1109/IEMBS.1995.579531

DO - 10.1109/IEMBS.1995.579531

M3 - Conference contribution

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Frieswijk TA, Frieswijk TA, Bielen JA, Bielen JA, Rutten W. Development of a solderbump technique for contacting a three-dimensional multi electrode array. In Proceedings 17th Annual International Conference of the IEEE EMBS. Montreal, Canada: IEEE. 1995. p. - https://doi.org/10.1109/IEMBS.1995.579531