Development of a solderbump technique for contacting a three-dimensional multi electrode array

Theo A. Frieswijk, Jeroen A. Bielen, Wim L.C. Rutten

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    Abstract

    The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacing
    Original languageEnglish
    Title of host publicationProceedings 17th Annual International Conference of the IEEE EMBS 1995
    Place of PublicationPiscataway, NJ
    PublisherIEEE
    Pages1101-1102
    Number of pages2
    Volume2
    ISBN (Print)0-7803-2475-7
    DOIs
    Publication statusPublished - 20 Sep 1995
    Event17th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1995 - Montreal, Canada
    Duration: 20 Sep 199523 Sep 1995

    Conference

    Conference17th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1995
    Abbreviated titleEMBC
    CountryCanada
    CityMontreal
    Period20/09/9523/09/95

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  • Cite this

    Frieswijk, T. A., Bielen, J. A., & Rutten, W. L. C. (1995). Development of a solderbump technique for contacting a three-dimensional multi electrode array. In Proceedings 17th Annual International Conference of the IEEE EMBS 1995 (Vol. 2, pp. 1101-1102). Piscataway, NJ: IEEE. https://doi.org/10.1109/IEMBS.1995.579531