Development of a solderbump technique for contacting a three-dimensional multi electrode array

Theo A. Frieswijk; Jeroen A. Bielen; Wim L.C. Rutten

doi:10.1109/IEMBS.1995.579531

Development of a solderbump technique for contacting a three-dimensional multi electrode array

Theo A. Frieswijk, Jeroen A. Bielen, Wim L.C. Rutten

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

2 Citations (Scopus)

77 Downloads (Pure)

Abstract

The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacing

Original language	English
Title of host publication	Proceedings 17th Annual International Conference of the IEEE EMBS 1995
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	1101-1102
Number of pages	2
Volume	2
ISBN (Print)	0-7803-2475-7
DOIs	https://doi.org/10.1109/IEMBS.1995.579531
Publication status	Published - 20 Sept 1995
Event	17th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1995 - Montreal, Canada Duration: 20 Sept 1995 → 23 Sept 1995

Conference

Conference	17th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1995
Abbreviated title	EMBC
Country/Territory	Canada
City	Montreal
Period	20/09/95 → 23/09/95

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10.1109/IEMBS.1995.579531

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title = "Development of a solderbump technique for contacting a three-dimensional multi electrode array",

abstract = "The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacing",

author = "Frieswijk, {Theo A.} and Bielen, {Jeroen A.} and Rutten, {Wim L.C.}",

year = "1995",

month = sep,

day = "20",

doi = "10.1109/IEMBS.1995.579531",

language = "English",

isbn = "0-7803-2475-7",

volume = "2",

pages = "1101--1102",

booktitle = "Proceedings 17th Annual International Conference of the IEEE EMBS 1995",

publisher = "IEEE",

address = "United States",

note = "17th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1995, EMBC ; Conference date: 20-09-1995 Through 23-09-1995",

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Frieswijk, TA, Bielen, JA & Rutten, WLC 1995, Development of a solderbump technique for contacting a three-dimensional multi electrode array. in Proceedings 17th Annual International Conference of the IEEE EMBS 1995. vol. 2, IEEE, Piscataway, NJ, pp. 1101-1102, 17th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1995, Montreal, Quebec, Canada, 20/09/95. https://doi.org/10.1109/IEMBS.1995.579531

Development of a solderbump technique for contacting a three-dimensional multi electrode array. / Frieswijk, Theo A.; Bielen, Jeroen A.; Rutten, Wim L.C.
Proceedings 17th Annual International Conference of the IEEE EMBS 1995. Vol. 2 Piscataway, NJ: IEEE, 1995. p. 1101-1102.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Development of a solderbump technique for contacting a three-dimensional multi electrode array

AU - Frieswijk, Theo A.

AU - Bielen, Jeroen A.

AU - Rutten, Wim L.C.

PY - 1995/9/20

Y1 - 1995/9/20

N2 - The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacing

AB - The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacing

U2 - 10.1109/IEMBS.1995.579531

DO - 10.1109/IEMBS.1995.579531

M3 - Conference contribution

SN - 0-7803-2475-7

VL - 2

SP - 1101

EP - 1102

BT - Proceedings 17th Annual International Conference of the IEEE EMBS 1995

PB - IEEE

CY - Piscataway, NJ

T2 - 17th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 1995

Y2 - 20 September 1995 through 23 September 1995

ER -

Development of a solderbump technique for contacting a three-dimensional multi electrode array

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