Development of a solderbump technique for contacting a three-dimensional multi electrode array

T.A. Frieswijk, J.A. Bielen, Wim Rutten

Research output: Other contributionOther research output

Original languageUndefined
Place of PublicationPutten
Publication statusPublished - 19 Oct 1995

Keywords

  • METIS-115009

Cite this

Frieswijk, T. A., Bielen, J. A., & Rutten, W. (1995, Oct 19). Development of a solderbump technique for contacting a three-dimensional multi electrode array. Putten.
Frieswijk, T.A. ; Bielen, J.A. ; Rutten, Wim. / Development of a solderbump technique for contacting a three-dimensional multi electrode array. 1995. Putten.
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title = "Development of a solderbump technique for contacting a three-dimensional multi electrode array",
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author = "T.A. Frieswijk and J.A. Bielen and Wim Rutten",
year = "1995",
month = "10",
day = "19",
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}

Development of a solderbump technique for contacting a three-dimensional multi electrode array. / Frieswijk, T.A.; Bielen, J.A.; Rutten, Wim.

Putten. 1995, .

Research output: Other contributionOther research output

TY - GEN

T1 - Development of a solderbump technique for contacting a three-dimensional multi electrode array

AU - Frieswijk, T.A.

AU - Bielen, J.A.

AU - Rutten, Wim

PY - 1995/10/19

Y1 - 1995/10/19

KW - METIS-115009

M3 - Other contribution

CY - Putten

ER -