Development of a solderbump technique for contacting a three-dimensional multi electrode array

T.A. Frieswijk, J.A. Bielen, Wim Rutten

    Research output: Other contribution › Other research output

    Original languageUndefined
    Place of PublicationPutten
    Publication statusPublished - 19 Oct 1995

    Keywords

    • METIS-115009

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