Diffusion Barrier Layers for Copper IC Metallization

A.A. van Zomeren, J. Holleman, P.H. Woerlee

    Research output: Other contributionOther research output

    Original languageUndefined
    Place of PublicationEnschede, the Netherlands
    Publication statusPublished - 23 Jun 1998

    Keywords

    • METIS-114888

    Cite this

    van Zomeren, A. A., Holleman, J., & Woerlee, P. H. (1998, Jun 23). Diffusion Barrier Layers for Copper IC Metallization. Enschede, the Netherlands.