Diffusion Barrier Layers for Copper IC Metallization

A.A. van Zomeren, J. Holleman, P.H. Woerlee

    Research output: Other contribution › Other research output

    Original languageUndefined
    Place of PublicationEnschede, the Netherlands
    Publication statusPublished - 23 Jun 1998

    Keywords

    • METIS-114888

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