Abstract
In-plane linear displacements of microelectromechanical systems are measured with subnanometer accuracy by observing the periodic micropatterns with a charge-coupled device camera attached to an optical microscope. The translation of the microstructure is retrieved from
the video by phase-shift computation using discrete Fourier transform analysis. This approach is validated through measurements on silicon devices featuring steep-sided periodic microstructures. The results are consistent with the electrical readout of a bulk micromachined capacitive
sensor, demonstrating the suitability of this technique for both calibration and sensing. Using a vibration isolation table, a standard deviation of σ = 0.13 nm could be achieved, enabling a measurement resolution of 0.5 nm (4σ) and a subpixel resolution better than 1/100 pixel. [2010-0170]
Original language | Undefined |
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Pages (from-to) | 355-360 |
Number of pages | 6 |
Journal | Sensors and Actuators A: Physical |
Volume | 162 |
Issue number | 2 |
DOIs | |
Publication status | Published - 19 Feb 2010 |
Keywords
- EWI-18544
- TST-Life like
- Source localization
- IR-73658
- Flow sensors
- METIS-271055
- Artificial lateral-line