Direct wafer bonding with chemical mechanical polishing: applications in sensors and actuators

Cheng-Qun Gui

Research output: Thesis › PhD Thesis - Research UT, graduation UT

Original language	English
Qualification	Doctor of Philosophy
Awarding Institution	University of Twente
Supervisors/Advisors	Elwenspoek, M.C., Supervisor Gardeniers, J.G.E., Co-Supervisor Lambeck, P.V., Co-Supervisor
Award date	13 Nov 1998
Place of Publication	Enschede
Publisher	University of Twente
Print ISBNs	90-365-1232-8
Publication status	Published - 13 Nov 1998

Cite this

@phdthesis{61e801928ac84212be42e77a3c10d8c6,

title = "Direct wafer bonding with chemical mechanical polishing: applications in sensors and actuators",

author = "Cheng-Qun Gui",

year = "1998",

month = nov,

day = "13",

language = "English",

isbn = "90-365-1232-8",

publisher = "University of Twente",

address = "Netherlands",

type = "PhD Thesis - Research UT, graduation UT",

school = "University of Twente",

}