DIRECTLY INJECTED FORCED CONVECTION COOLING FOR ELECTRONICS

Maria Brok, Gerrit Johannes Hendrikus; Wessel Willems Wits; Hendrik Mannak, Jan; Rob Legtenberg

DIRECTLY INJECTED FORCED CONVECTION COOLING FOR ELECTRONICS

Maria Brok, Gerrit Johannes Hendrikus (Inventor), Wessel Willems Wits (Inventor), Hendrik Mannak, Jan (Inventor), Rob Legtenberg (Inventor)

University of Twente

Research output: Patent

Abstract

Electronic circuitry includes a circuit board and at least one component mounted on the circuit board, with the at least one component generating heat while in use. The circuit board includes one or more apertures aligned with one or more respective components, and the electronic circuitry is configured to provide, while in use, a path for coolant fluid to flow through each aperture and past the respective component.

Original language	English
Patent number	US2012127661
IPC	H05K 3/ 10 A I
Priority date	13/12/11
Publication status	Published - 24 May 2012

Cite this

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title = "DIRECTLY INJECTED FORCED CONVECTION COOLING FOR ELECTRONICS",

abstract = "Electronic circuitry includes a circuit board and at least one component mounted on the circuit board, with the at least one component generating heat while in use. The circuit board includes one or more apertures aligned with one or more respective components, and the electronic circuitry is configured to provide, while in use, a path for coolant fluid to flow through each aperture and past the respective component.",

author = "{Brok, Gerrit Johannes Hendrikus}, Maria and Wits, {Wessel Willems} and {Mannak, Jan}, Hendrik and Rob Legtenberg",

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language = "English",

type = "Patent",

note = "US2012127661; H05K 3/ 10 A I",

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TY - PAT

T1 - DIRECTLY INJECTED FORCED CONVECTION COOLING FOR ELECTRONICS

AU - Brok, Gerrit Johannes Hendrikus, Maria

AU - Wits, Wessel Willems

AU - Mannak, Jan, Hendrik

AU - Legtenberg, Rob

PY - 2012/5/24

Y1 - 2012/5/24

N2 - Electronic circuitry includes a circuit board and at least one component mounted on the circuit board, with the at least one component generating heat while in use. The circuit board includes one or more apertures aligned with one or more respective components, and the electronic circuitry is configured to provide, while in use, a path for coolant fluid to flow through each aperture and past the respective component.

AB - Electronic circuitry includes a circuit board and at least one component mounted on the circuit board, with the at least one component generating heat while in use. The circuit board includes one or more apertures aligned with one or more respective components, and the electronic circuitry is configured to provide, while in use, a path for coolant fluid to flow through each aperture and past the respective component.

M3 - Patent

M1 - US2012127661

ER -

DIRECTLY INJECTED FORCED CONVECTION COOLING FOR ELECTRONICS

Abstract

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