Domain Integration and Cost Reduction in Electronic Product Design: a case study

Wessel Willems Wits; Thomas H.J. Vaneker; Jan Mannak; Frederikus J.A.M. van Houten

Domain Integration and Cost Reduction in Electronic Product Design: a case study

Wessel Willems Wits, Thomas H.J. Vaneker, Jan Mannak, Frederikus J.A.M. van Houten

Faculty of Engineering Technology

Research output: Contribution to conference › Paper

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Abstract

This publication discusses domain integration of various engineering disciplines as an effective methodology to design new, innovative products or to upgrade existing ones. A case study illustrates how this approach is applied to the design process of a high performance electronic product. Thanks to newly developed cooling technologies, fewer constraints are put on the location of heat dissipating components with respect to their heat exchanger. This allows for more overall design flexibility, which can result in a more integrated product design with advantages in terms of performance, volume, weight and production efficiency

Original language	Undefined
Publication status	Published - 2007
Event	40th CIRP International Seminar on Manufacturing Systems 2007 - University of Liverpool, Liverpool, United Kingdom Duration: 30 May 2007 → 1 Jun 2007 Conference number: 40

Conference

Conference	40th CIRP International Seminar on Manufacturing Systems 2007
Country/Territory	United Kingdom
City	Liverpool
Period	30/05/07 → 1/06/07

Keywords

IR-95797

Access to Document

Paper CIRP MS 2007 - Wessel Wits

Cite this

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title = "Domain Integration and Cost Reduction in Electronic Product Design: a case study",

abstract = "This publication discusses domain integration of various engineering disciplines as an effective methodology to design new, innovative products or to upgrade existing ones. A case study illustrates how this approach is applied to the design process of a high performance electronic product. Thanks to newly developed cooling technologies, fewer constraints are put on the location of heat dissipating components with respect to their heat exchanger. This allows for more overall design flexibility, which can result in a more integrated product design with advantages in terms of performance, volume, weight and production efficiency",

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author = "Wits, {Wessel Willems} and Vaneker, {Thomas H.J.} and Jan Mannak and {van Houten}, {Frederikus J.A.M.}",

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note = "40th CIRP International Seminar on Manufacturing Systems 2007 ; Conference date: 30-05-2007 Through 01-06-2007",

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AU - Wits, Wessel Willems

AU - Vaneker, Thomas H.J.

AU - Mannak, Jan

AU - van Houten, Frederikus J.A.M.

N1 - Conference code: 40

PY - 2007

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N2 - This publication discusses domain integration of various engineering disciplines as an effective methodology to design new, innovative products or to upgrade existing ones. A case study illustrates how this approach is applied to the design process of a high performance electronic product. Thanks to newly developed cooling technologies, fewer constraints are put on the location of heat dissipating components with respect to their heat exchanger. This allows for more overall design flexibility, which can result in a more integrated product design with advantages in terms of performance, volume, weight and production efficiency

AB - This publication discusses domain integration of various engineering disciplines as an effective methodology to design new, innovative products or to upgrade existing ones. A case study illustrates how this approach is applied to the design process of a high performance electronic product. Thanks to newly developed cooling technologies, fewer constraints are put on the location of heat dissipating components with respect to their heat exchanger. This allows for more overall design flexibility, which can result in a more integrated product design with advantages in terms of performance, volume, weight and production efficiency

KW - IR-95797

M3 - Paper

T2 - 40th CIRP International Seminar on Manufacturing Systems 2007

Y2 - 30 May 2007 through 1 June 2007

ER -