Domain Integration and Cost Reduction in Electronic Product Design: a case study

Wessel Willems Wits, Thomas H.J. Vaneker, Jan Mannak, Frederikus J.A.M. van Houten

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This publication discusses domain integration of various engineering disciplines as an effective methodology to design new, innovative products or to upgrade existing ones. A case study illustrates how this approach is applied to the design process of a high performance electronic product. Thanks to newly developed cooling technologies, fewer constraints are put on the location of heat dissipating components with respect to their heat exchanger. This allows for more overall design flexibility, which can result in a more integrated product design with advantages in terms of performance, volume, weight and production efficiency
Original languageUndefined
Publication statusPublished - 2007
Event40th CIRP International Seminar on Manufacturing Systems 2007 - University of Liverpool, Liverpool, United Kingdom
Duration: 30 May 20071 Jun 2007
Conference number: 40


Conference40th CIRP International Seminar on Manufacturing Systems 2007
Country/TerritoryUnited Kingdom


  • IR-95797

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