TY - JOUR
T1 - Doping of semiconductors by molecular monolayers
T2 - monolayer formation, dopant diffusion and applications
AU - Ye, Liang
AU - de Jong, Machiel Pieter
AU - Kudernac, Tibor
AU - van der Wiel, Wilfred G.
AU - Huskens, Jurriaan
PY - 2017/5/1
Y1 - 2017/5/1
N2 - The continuous miniaturization in the semiconductor industry brings electronic devices with higher performance at lower cost. The doping of semiconductor materials plays a crucial role in tuning the electrical properties of the materials. Ion implantation is currently widely used. Yet, this technique faces challenges meeting the requirements for smaller devices. Monolayer doping (MLD) has been proposed as one of the alternative techniques for doping semiconductors. It utilizes dopant-containing organic molecules and grafts them onto semiconductor surfaces. The dopant atoms are subsequently driven into the substrate by high temperature annealing. MLD has shown the capability for ultra-shallow doping and the doping of 3-D structures without causing crystal damage. These features make this technique a promising candidate to dope future electronic devices. In this review the processes for monolayer formation and dopant incorporation by annealing will be discussed, as well as the applications of MLD in device fabrication.
AB - The continuous miniaturization in the semiconductor industry brings electronic devices with higher performance at lower cost. The doping of semiconductor materials plays a crucial role in tuning the electrical properties of the materials. Ion implantation is currently widely used. Yet, this technique faces challenges meeting the requirements for smaller devices. Monolayer doping (MLD) has been proposed as one of the alternative techniques for doping semiconductors. It utilizes dopant-containing organic molecules and grafts them onto semiconductor surfaces. The dopant atoms are subsequently driven into the substrate by high temperature annealing. MLD has shown the capability for ultra-shallow doping and the doping of 3-D structures without causing crystal damage. These features make this technique a promising candidate to dope future electronic devices. In this review the processes for monolayer formation and dopant incorporation by annealing will be discussed, as well as the applications of MLD in device fabrication.
KW - Dopant
KW - Germanium
KW - Group III-V semiconductors
KW - Monolayer doping
KW - Silicon
KW - Transistor
KW - 2023 OA procedure
UR - http://www.scopus.com/inward/record.url?scp=85009809641&partnerID=8YFLogxK
U2 - 10.1016/j.mssp.2016.12.018
DO - 10.1016/j.mssp.2016.12.018
M3 - Review article
AN - SCOPUS:85009809641
SN - 1369-8001
VL - 62
SP - 128
EP - 134
JO - Materials science in semiconductor processing
JF - Materials science in semiconductor processing
ER -