Abstract
A complete description for early resistance change and mechanical stress evolution in near-bamboo interconnects, related to the electromigration, is given in this paper. The proposed model, for the first time, combines the stress/vacancy concentration evolution with the early resistance change of the Al line with a near-bamboo microstructure, which has been proven to be a fast technique for prediction of the MTF of a line compared to the conventional (accelerated) stress
Original language | Undefined |
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Title of host publication | Proceedings of 1997 International Semiconductor Conference |
Place of Publication | Sinaia Romania |
Publisher | IEEE |
Pages | 311-314 |
Number of pages | 4 |
ISBN (Print) | 9780780338043 |
DOIs | |
Publication status | Published - 1 Jan 1997 |
Event | 20th International Semiconductor Conference, CAS'97 - Sinaia, Romania Duration: 7 Oct 1997 → 11 Oct 1997 Conference number: 20 |
Publication series
Name | |
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Publisher | IEEE |
Volume | 2 |
Conference
Conference | 20th International Semiconductor Conference, CAS'97 |
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Abbreviated title | CAS 1997 |
Country/Territory | Romania |
City | Sinaia |
Period | 7/10/97 → 11/10/97 |
Keywords
- METIS-113870
- IR-16985