Effect of a titanium nitride interlayer on the densification, properties and microstructure of cermets based on alumina and nickel. Part 2: Microstructures

Shujie Li, Paul Babayan Khosrovabadi, Ben H. Kolster

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SEM microstructural analyses in conjunction with EDX and TEM microstructural analyses have been conducted with cermets based on nickel and alumina, the latter as such and with a chemical-vapour-deposited titanium nitride layer. It has been proved that there is excellent bonding at both the Al2O3/TiN and the TiN/Ni interface, whereas Al2O3 and Ni do not adhere to each other. This is the reason for the observation that the mechanical properties as well as the densification of cermets consisting of Al2O3 and Ni are enhanced by applying a TiN interlayer between the ceramic phase and the metallic phase.
Original languageUndefined
Pages (from-to)193-200
JournalInternational Journal of Refractory Metals and Hard Materials
Issue number3
Publication statusPublished - 1992
Externally publishedYes


  • IR-57525

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