SEM microstructural analyses in conjunction with EDX and TEM microstructural analyses have been conducted with cermets based on nickel and alumina, the latter as such and with a chemical-vapour-deposited titanium nitride layer. It has been proved that there is excellent bonding at both the Al2O3/TiN and the TiN/Ni interface, whereas Al2O3 and Ni do not adhere to each other. This is the reason for the observation that the mechanical properties as well as the densification of cermets consisting of Al2O3 and Ni are enhanced by applying a TiN interlayer between the ceramic phase and the metallic phase.
|Journal||International Journal of Refractory Metals and Hard Materials|
|Publication status||Published - 1992|