Effect of thermal gradients on the electromigration lifetime in power electronics

H.V. Nguyen; C. Salm; B. Krabbenborg; K. Weide-Zaage; J. Bisschop; A.J. Mouthaan; F.G. Kuper

doi:10.1109/RELPHY.2004.1315418

Effect of thermal gradients on the electromigration lifetime in power electronics

H.V. Nguyen, C. Salm, B. Krabbenborg, K. Weide-Zaage, J. Bisschop, A.J. Mouthaan, F.G. Kuper

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

15 Citations (Scopus)

54 Downloads (Pure)

Abstract

The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.

Original language	English
Title of host publication	2004 IEEE International Reliability Physics Symposium proceedings
Subtitle of host publication	42nd Annual : Phoenix, Arizona, April 25-29, 2004
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	619-620
Number of pages	2
ISBN (Print)	0-7803-8315-X
DOIs	https://doi.org/10.1109/RELPHY.2004.1315418
Publication status	Published - 26 Jul 2004
Event	42nd Annual IEEE International Reliability Physics Symposium, IRPS 2004 - Phoenix, United States Duration: 25 Apr 2004 → 29 Apr 2004 Conference number: 42

Conference

Conference	42nd Annual IEEE International Reliability Physics Symposium, IRPS 2004
Abbreviated title	IRPS
Country/Territory	United States
City	Phoenix
Period	25/04/04 → 29/04/04

Keywords

2024 OA procedure
Durability
Electrodiffusion
Reliability
Power electronics
Temperature gradient
Failures

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10.1109/RELPHY.2004.1315418

ArticleFinal published version, 164 KBLicence: Taverne

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Nguyen, H. V., Salm, C., Krabbenborg, B., Weide-Zaage, K., Bisschop, J., Mouthaan, A. J., & Kuper, F. G. (2004). Effect of thermal gradients on the electromigration lifetime in power electronics. In 2004 IEEE International Reliability Physics Symposium proceedings: 42nd Annual : Phoenix, Arizona, April 25-29, 2004 (pp. 619-620). IEEE. https://doi.org/10.1109/RELPHY.2004.1315418

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title = "Effect of thermal gradients on the electromigration lifetime in power electronics",

abstract = "The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.",

keywords = "2024 OA procedure, Durability, Electrodiffusion, Reliability, Power electronics, Temperature gradient, Failures",

author = "H.V. Nguyen and C. Salm and B. Krabbenborg and K. Weide-Zaage and J. Bisschop and A.J. Mouthaan and F.G. Kuper",

year = "2004",

month = jul,

day = "26",

doi = "10.1109/RELPHY.2004.1315418",

language = "English",

isbn = "0-7803-8315-X",

pages = "619--620",

booktitle = "2004 IEEE International Reliability Physics Symposium proceedings",

publisher = "IEEE",

address = "United States",

note = "42nd Annual IEEE International Reliability Physics Symposium, IRPS 2004, IRPS ; Conference date: 25-04-2004 Through 29-04-2004",

}

Nguyen, HV, Salm, C, Krabbenborg, B, Weide-Zaage, K, Bisschop, J, Mouthaan, AJ & Kuper, FG 2004, Effect of thermal gradients on the electromigration lifetime in power electronics. in 2004 IEEE International Reliability Physics Symposium proceedings: 42nd Annual : Phoenix, Arizona, April 25-29, 2004 . IEEE, Piscataway, NJ, pp. 619-620, 42nd Annual IEEE International Reliability Physics Symposium, IRPS 2004, Phoenix, Arizona, United States, 25/04/04. https://doi.org/10.1109/RELPHY.2004.1315418

Effect of thermal gradients on the electromigration lifetime in power electronics. / Nguyen, H.V.; Salm, C.; Krabbenborg, B. et al.
2004 IEEE International Reliability Physics Symposium proceedings: 42nd Annual : Phoenix, Arizona, April 25-29, 2004 . Piscataway, NJ: IEEE, 2004. p. 619-620.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Effect of thermal gradients on the electromigration lifetime in power electronics

AU - Nguyen, H.V.

AU - Salm, C.

AU - Krabbenborg, B.

AU - Weide-Zaage, K.

AU - Bisschop, J.

AU - Mouthaan, A.J.

AU - Kuper, F.G.

N1 - Conference code: 42

PY - 2004/7/26

Y1 - 2004/7/26

N2 - The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.

AB - The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.

KW - 2024 OA procedure

KW - Durability

KW - Electrodiffusion

KW - Reliability

KW - Power electronics

KW - Temperature gradient

KW - Failures

U2 - 10.1109/RELPHY.2004.1315418

DO - 10.1109/RELPHY.2004.1315418

M3 - Conference contribution

SN - 0-7803-8315-X

SP - 619

EP - 620

BT - 2004 IEEE International Reliability Physics Symposium proceedings

PB - IEEE

CY - Piscataway, NJ

T2 - 42nd Annual IEEE International Reliability Physics Symposium, IRPS 2004

Y2 - 25 April 2004 through 29 April 2004

ER -

Effect of thermal gradients on the electromigration lifetime in power electronics

Abstract

Conference

Keywords

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