Embedded Sensing: Making the best of 3D printed sensors

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

31 Downloads (Pure)

Abstract

Current Additive Manufacturing allows for the implementation of electrically interrogated 3D printed sen- sors. In this contribution various technologies, sensing principles and applications are discussed. We will give both an overview of some of the sensors presented in literature as well as some of our own 3D printed sensors work.
Original languageEnglish
Title of host publicationProceedings Sensor 2017
PublisherAMA Services GmbH
Pages431-437
Number of pages7
ISBN (Print)978-3-9816876-4-4
DOIs
Publication statusPublished - 30 May 2017
Event18th International Conference on Sensors and Measurement Technology 2017 - Nuermberg Exhibition Centre, Germany, Nuermberg, Germany
Duration: 30 May 20171 Jun 2017
Conference number: 18
http://www.ama-science.org/ama-conferences/sensor-test-the-measurement-fair/

Conference

Conference18th International Conference on Sensors and Measurement Technology 2017
Abbreviated titleSENSOR 2017
CountryGermany
CityNuermberg
Period30/05/171/06/17
Internet address

Fingerprint

Sensors
3D printers

Keywords

  • Additive Manufacturing
  • 3D Printing
  • transducers
  • Embedded sensing

Cite this

@inproceedings{d04100ad8dc84c0cbf48a9f88c9a9ec6,
title = "Embedded Sensing: Making the best of 3D printed sensors",
abstract = "Current Additive Manufacturing allows for the implementation of electrically interrogated 3D printed sen- sors. In this contribution various technologies, sensing principles and applications are discussed. We will give both an overview of some of the sensors presented in literature as well as some of our own 3D printed sensors work.",
keywords = "Additive Manufacturing, 3D Printing, transducers, Embedded sensing",
author = "Patrick Werkman and Welleweerd, {Marcel Klaas} and Wolterink, {Gerhard Jan Willem} and John Delamare and Sanders, {Remco G.P.} and Krijnen, {Gijsbertus J.M.} and Alexander Dijkshoorn",
year = "2017",
month = "5",
day = "30",
doi = "10.5162/sensor2017/D1.3",
language = "English",
isbn = "978-3-9816876-4-4",
pages = "431--437",
booktitle = "Proceedings Sensor 2017",
publisher = "AMA Services GmbH",

}

Werkman, P, Welleweerd, MK, Wolterink, GJW, Delamare, J, Sanders, RGP, Krijnen, GJM & Dijkshoorn, A 2017, Embedded Sensing: Making the best of 3D printed sensors. in Proceedings Sensor 2017. AMA Services GmbH, pp. 431-437, 18th International Conference on Sensors and Measurement Technology 2017, Nuermberg, Germany, 30/05/17. https://doi.org/10.5162/sensor2017/D1.3

Embedded Sensing : Making the best of 3D printed sensors. / Werkman, Patrick; Welleweerd, Marcel Klaas; Wolterink, Gerhard Jan Willem; Delamare, John; Sanders, Remco G.P.; Krijnen, Gijsbertus J.M.; Dijkshoorn, Alexander.

Proceedings Sensor 2017. AMA Services GmbH, 2017. p. 431-437.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

TY - GEN

T1 - Embedded Sensing

T2 - Making the best of 3D printed sensors

AU - Werkman, Patrick

AU - Welleweerd, Marcel Klaas

AU - Wolterink, Gerhard Jan Willem

AU - Delamare, John

AU - Sanders, Remco G.P.

AU - Krijnen, Gijsbertus J.M.

AU - Dijkshoorn, Alexander

PY - 2017/5/30

Y1 - 2017/5/30

N2 - Current Additive Manufacturing allows for the implementation of electrically interrogated 3D printed sen- sors. In this contribution various technologies, sensing principles and applications are discussed. We will give both an overview of some of the sensors presented in literature as well as some of our own 3D printed sensors work.

AB - Current Additive Manufacturing allows for the implementation of electrically interrogated 3D printed sen- sors. In this contribution various technologies, sensing principles and applications are discussed. We will give both an overview of some of the sensors presented in literature as well as some of our own 3D printed sensors work.

KW - Additive Manufacturing

KW - 3D Printing

KW - transducers

KW - Embedded sensing

U2 - 10.5162/sensor2017/D1.3

DO - 10.5162/sensor2017/D1.3

M3 - Conference contribution

SN - 978-3-9816876-4-4

SP - 431

EP - 437

BT - Proceedings Sensor 2017

PB - AMA Services GmbH

ER -