Embedded Test Instrument for Intermittent Resistive Fault Detection at Chip Level and Its Reuse at Board Level

Hassan Ebrahimi; Hans G. Kerkhoff

doi:10.1109/DDECS52668.2021.9417064

Embedded Test Instrument for Intermittent Resistive Fault Detection at Chip Level and Its Reuse at Board Level

Hassan Ebrahimi
, Hans G. Kerkhoff

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

No-fault-founds (NFFs) threaten the dependability of highly dependable systems in avionic and car industries. Moreover, they drastically increase the test and maintenance costs. One of the main causes of NFFs is intermittent resistive faults (IRFs). IRFs mostly occur due to unstable and marginal interconnections. This paper proposes a new periodic testing method to detect IRFs in interconnections at the chip and the board level. The proposed method is based on on-chip embedded test instruments (ETIs), which are scalable, fully digital, and With a low hardware cost. As a case study, a network-on-chip (NoC) infrastructure with a mesh topology has been utilised. The implementation of the testing method requires a small chip area and power consumption overheads being 3% and 2.5%, respectively. In this paper, first, IRF detection at the chip level has been investigated using simulation-based fault injections in selected interconnections of the NoC. Then, the effectiveness of the proposed method at the board level has been verified by hardware-based fault injections as well as thermal cycling experiments on actual solder joints. The experimental results demonstrated that the on-chip ETIs can be reused effectively to detect IRFs at the board level.

Original language	English
Title of host publication	Proceedings - 2021 24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021
Editors	Muhammad Shafique, Andreas Steininger, Lukas Sekanina, Milos Krstic, Goran Stojanovic, Vojtech Mrazek
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	75-80
Number of pages	6
ISBN (Electronic)	978-1-6654-3595-6
ISBN (Print)	978-1-6654-1181-3
DOIs	https://doi.org/10.1109/DDECS52668.2021.9417064
Publication status	Published - 7 Apr 2021
Event	24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021 - Vienna, Austria Duration: 7 Apr 2021 → 9 Apr 2021 Conference number: 24

Publication series

Name	Proceedings - International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS
Publisher	IEEE
Number	24
Volume	2021
ISSN (Print)	2334-3133
ISSN (Electronic)	2473-2117

Conference

Conference	24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021
Abbreviated title	DDECS 2021
Country/Territory	Austria
City	Vienna
Period	7/04/21 → 9/04/21

Keywords

Board-level
Intermittent resistive Fault
Intermittent resistive Fault Detection
NetWork-on-chip
Reliability
n/a OA procedure

Access to Document

10.1109/DDECS52668.2021.9417064

Cite this

Ebrahimi, H., & Kerkhoff, H. G. (2021). Embedded Test Instrument for Intermittent Resistive Fault Detection at Chip Level and Its Reuse at Board Level. In M. Shafique, A. Steininger, L. Sekanina, M. Krstic, G. Stojanovic, & V. Mrazek (Eds.), Proceedings - 2021 24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021 (pp. 75-80). Article 9417064 (Proceedings - International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS; Vol. 2021, No. 24). IEEE. https://doi.org/10.1109/DDECS52668.2021.9417064

Ebrahimi, Hassan ; Kerkhoff, Hans G. / Embedded Test Instrument for Intermittent Resistive Fault Detection at Chip Level and Its Reuse at Board Level. Proceedings - 2021 24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021. editor / Muhammad Shafique ; Andreas Steininger ; Lukas Sekanina ; Milos Krstic ; Goran Stojanovic ; Vojtech Mrazek. Piscataway, NJ : IEEE, 2021. pp. 75-80 (Proceedings - International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS; 24).

@inproceedings{4b4301e4fb29494ebd1e25d75332abb8,

title = "Embedded Test Instrument for Intermittent Resistive Fault Detection at Chip Level and Its Reuse at Board Level",

abstract = "No-fault-founds (NFFs) threaten the dependability of highly dependable systems in avionic and car industries. Moreover, they drastically increase the test and maintenance costs. One of the main causes of NFFs is intermittent resistive faults (IRFs). IRFs mostly occur due to unstable and marginal interconnections. This paper proposes a new periodic testing method to detect IRFs in interconnections at the chip and the board level. The proposed method is based on on-chip embedded test instruments (ETIs), which are scalable, fully digital, and With a low hardware cost. As a case study, a network-on-chip (NoC) infrastructure with a mesh topology has been utilised. The implementation of the testing method requires a small chip area and power consumption overheads being 3\% and 2.5\%, respectively. In this paper, first, IRF detection at the chip level has been investigated using simulation-based fault injections in selected interconnections of the NoC. Then, the effectiveness of the proposed method at the board level has been verified by hardware-based fault injections as well as thermal cycling experiments on actual solder joints. The experimental results demonstrated that the on-chip ETIs can be reused effectively to detect IRFs at the board level.",

keywords = "Board-level, Intermittent resistive Fault, Intermittent resistive Fault Detection, NetWork-on-chip, Reliability, n/a OA procedure",

author = "Hassan Ebrahimi and Kerkhoff, \{Hans G.\}",

note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021, DDECS 2021 ; Conference date: 07-04-2021 Through 09-04-2021",

year = "2021",

month = apr,

day = "7",

doi = "10.1109/DDECS52668.2021.9417064",

language = "English",

isbn = "978-1-6654-1181-3",

series = "Proceedings - International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS",

publisher = "IEEE",

number = "24",

pages = "75--80",

editor = "Muhammad Shafique and Andreas Steininger and Lukas Sekanina and Milos Krstic and Goran Stojanovic and Vojtech Mrazek",

booktitle = "Proceedings - 2021 24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021",

address = "United States",

}

Ebrahimi, H & Kerkhoff, HG 2021, Embedded Test Instrument for Intermittent Resistive Fault Detection at Chip Level and Its Reuse at Board Level. in M Shafique, A Steininger, L Sekanina, M Krstic, G Stojanovic & V Mrazek (eds), Proceedings - 2021 24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021., 9417064, Proceedings - International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS, no. 24, vol. 2021, IEEE, Piscataway, NJ, pp. 75-80, 24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021, Vienna, Austria, 7/04/21. https://doi.org/10.1109/DDECS52668.2021.9417064

Embedded Test Instrument for Intermittent Resistive Fault Detection at Chip Level and Its Reuse at Board Level. / Ebrahimi, Hassan; Kerkhoff, Hans G.
Proceedings - 2021 24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021. ed. / Muhammad Shafique; Andreas Steininger; Lukas Sekanina; Milos Krstic; Goran Stojanovic; Vojtech Mrazek. Piscataway, NJ: IEEE, 2021. p. 75-80 9417064 (Proceedings - International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS; Vol. 2021, No. 24).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Embedded Test Instrument for Intermittent Resistive Fault Detection at Chip Level and Its Reuse at Board Level

AU - Ebrahimi, Hassan

AU - Kerkhoff, Hans G.

N1 - Conference code: 24

PY - 2021/4/7

Y1 - 2021/4/7

N2 - No-fault-founds (NFFs) threaten the dependability of highly dependable systems in avionic and car industries. Moreover, they drastically increase the test and maintenance costs. One of the main causes of NFFs is intermittent resistive faults (IRFs). IRFs mostly occur due to unstable and marginal interconnections. This paper proposes a new periodic testing method to detect IRFs in interconnections at the chip and the board level. The proposed method is based on on-chip embedded test instruments (ETIs), which are scalable, fully digital, and With a low hardware cost. As a case study, a network-on-chip (NoC) infrastructure with a mesh topology has been utilised. The implementation of the testing method requires a small chip area and power consumption overheads being 3% and 2.5%, respectively. In this paper, first, IRF detection at the chip level has been investigated using simulation-based fault injections in selected interconnections of the NoC. Then, the effectiveness of the proposed method at the board level has been verified by hardware-based fault injections as well as thermal cycling experiments on actual solder joints. The experimental results demonstrated that the on-chip ETIs can be reused effectively to detect IRFs at the board level.

AB - No-fault-founds (NFFs) threaten the dependability of highly dependable systems in avionic and car industries. Moreover, they drastically increase the test and maintenance costs. One of the main causes of NFFs is intermittent resistive faults (IRFs). IRFs mostly occur due to unstable and marginal interconnections. This paper proposes a new periodic testing method to detect IRFs in interconnections at the chip and the board level. The proposed method is based on on-chip embedded test instruments (ETIs), which are scalable, fully digital, and With a low hardware cost. As a case study, a network-on-chip (NoC) infrastructure with a mesh topology has been utilised. The implementation of the testing method requires a small chip area and power consumption overheads being 3% and 2.5%, respectively. In this paper, first, IRF detection at the chip level has been investigated using simulation-based fault injections in selected interconnections of the NoC. Then, the effectiveness of the proposed method at the board level has been verified by hardware-based fault injections as well as thermal cycling experiments on actual solder joints. The experimental results demonstrated that the on-chip ETIs can be reused effectively to detect IRFs at the board level.

KW - Board-level

KW - Intermittent resistive Fault

KW - Intermittent resistive Fault Detection

KW - NetWork-on-chip

KW - Reliability

KW - n/a OA procedure

UR - https://www.scopus.com/pages/publications/85105582082

U2 - 10.1109/DDECS52668.2021.9417064

DO - 10.1109/DDECS52668.2021.9417064

M3 - Conference contribution

AN - SCOPUS:85105582082

SN - 978-1-6654-1181-3

T3 - Proceedings - International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS

SP - 75

EP - 80

BT - Proceedings - 2021 24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021

A2 - Shafique, Muhammad

A2 - Steininger, Andreas

A2 - Sekanina, Lukas

A2 - Krstic, Milos

A2 - Stojanovic, Goran

A2 - Mrazek, Vojtech

PB - IEEE

CY - Piscataway, NJ

T2 - 24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021

Y2 - 7 April 2021 through 9 April 2021

ER -

Ebrahimi H, Kerkhoff HG. Embedded Test Instrument for Intermittent Resistive Fault Detection at Chip Level and Its Reuse at Board Level. In Shafique M, Steininger A, Sekanina L, Krstic M, Stojanovic G, Mrazek V, editors, Proceedings - 2021 24th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS 2021. Piscataway, NJ: IEEE. 2021. p. 75-80. 9417064. (Proceedings - International Symposium on Design and Diagnostics of Electronic Circuits and Systems, DDECS; 24). doi: 10.1109/DDECS52668.2021.9417064

Embedded Test Instrument for Intermittent Resistive Fault Detection at Chip Level and Its Reuse at Board Level

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Keywords

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