Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction

Niek Moonen; Frits Buesink; Frank Leferink

doi:10.1109/APEMC.2016.7523002

Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction

Niek Moonen, Frits Buesink, Frank Leferink

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

10 Citations (Scopus)

5 Downloads (Pure)

Abstract

Predicting high frequency behavior of systems with equivalent circuit simulations that are including component self-parasitic effects are not sufficiently accurate anymore. Mutual coupling, which is highly dependent on component/traces placement and orientation, has to be included in circuit models. Predicting the impact can be performed using 3D electromagnetic field simulations, but these are complex and time consuming. This paper suggest extracting the mutual coupling parameters from a parametric 3D model. The lumped elements, which represent the mutual coupling via the electromagnetic field, are back-annotated in the equivalent circuit model. Then circuit simulations can be performed very fast and the impact of the mutual coupling can be determined.

Original language	English
Title of host publication	2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
Place of Publication	USA
Publisher	IEEE
Pages	181-183
Number of pages	3
ISBN (Electronic)	978-1-4673-8310-3
ISBN (Print)	978-1-4673-8310-3
DOIs	https://doi.org/10.1109/APEMC.2016.7523002
Publication status	Published - 19 May 2016
Event	2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016 - Shenzhen, China Duration: 17 May 2016 → 21 May 2016

Conference

Conference	2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016
Abbreviated title	APEMC
Country/Territory	China
City	Shenzhen
Period	17/05/16 → 21/05/16

Keywords

22/3 OA procedure

Access to Document

10.1109/APEMC.2016.7523002

ArticleFinal published version, 1.01 MBLicence: Taverne

Cite this

@inproceedings{5c71701373a44abfbcf5abd2637a53bd,

title = "Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction",

abstract = "Predicting high frequency behavior of systems with equivalent circuit simulations that are including component self-parasitic effects are not sufficiently accurate anymore. Mutual coupling, which is highly dependent on component/traces placement and orientation, has to be included in circuit models. Predicting the impact can be performed using 3D electromagnetic field simulations, but these are complex and time consuming. This paper suggest extracting the mutual coupling parameters from a parametric 3D model. The lumped elements, which represent the mutual coupling via the electromagnetic field, are back-annotated in the equivalent circuit model. Then circuit simulations can be performed very fast and the impact of the mutual coupling can be determined.",

keywords = "22/3 OA procedure",

author = "Niek Moonen and Frits Buesink and Frank Leferink",

note = "eemcs-eprint-27142 ; 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016, APEMC ; Conference date: 17-05-2016 Through 21-05-2016",

year = "2016",

month = may,

day = "19",

doi = "10.1109/APEMC.2016.7523002",

language = "English",

isbn = "978-1-4673-8310-3",

pages = "181--183",

booktitle = "2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)",

publisher = "IEEE",

}

Moonen, N , Buesink, F & Leferink, F 2016, Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction. in 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC). IEEE, USA, pp. 181-183, 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016, Shenzhen, China, 17/05/16. https://doi.org/10.1109/APEMC.2016.7523002

Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction. / Moonen, Niek ; Buesink, Frits ; Leferink, Frank.

2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC). USA : IEEE, 2016. p. 181-183.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction

AU - Moonen, Niek

AU - Buesink, Frits

AU - Leferink, Frank

N1 - eemcs-eprint-27142

PY - 2016/5/19

Y1 - 2016/5/19

N2 - Predicting high frequency behavior of systems with equivalent circuit simulations that are including component self-parasitic effects are not sufficiently accurate anymore. Mutual coupling, which is highly dependent on component/traces placement and orientation, has to be included in circuit models. Predicting the impact can be performed using 3D electromagnetic field simulations, but these are complex and time consuming. This paper suggest extracting the mutual coupling parameters from a parametric 3D model. The lumped elements, which represent the mutual coupling via the electromagnetic field, are back-annotated in the equivalent circuit model. Then circuit simulations can be performed very fast and the impact of the mutual coupling can be determined.

AB - Predicting high frequency behavior of systems with equivalent circuit simulations that are including component self-parasitic effects are not sufficiently accurate anymore. Mutual coupling, which is highly dependent on component/traces placement and orientation, has to be included in circuit models. Predicting the impact can be performed using 3D electromagnetic field simulations, but these are complex and time consuming. This paper suggest extracting the mutual coupling parameters from a parametric 3D model. The lumped elements, which represent the mutual coupling via the electromagnetic field, are back-annotated in the equivalent circuit model. Then circuit simulations can be performed very fast and the impact of the mutual coupling can be determined.

KW - 22/3 OA procedure

U2 - 10.1109/APEMC.2016.7523002

DO - 10.1109/APEMC.2016.7523002

M3 - Conference contribution

SN - 978-1-4673-8310-3

SP - 181

EP - 183

BT - 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

PB - IEEE

CY - USA

T2 - 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016

Y2 - 17 May 2016 through 21 May 2016

ER -

Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction

Abstract

Conference

Keywords

Access to Document

Fingerprint

Cite this