Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction

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    8 Citations (Scopus)

    Abstract

    Predicting high frequency behavior of systems with equivalent circuit simulations that are including component self-parasitic effects are not sufficiently accurate anymore. Mutual coupling, which is highly dependent on component/traces placement and orientation, has to be included in circuit models. Predicting the impact can be performed using 3D electromagnetic field simulations, but these are complex and time consuming. This paper suggest extracting the mutual coupling parameters from a parametric 3D model. The lumped elements, which represent the mutual coupling via the electromagnetic field, are back-annotated in the equivalent circuit model. Then circuit simulations can be performed very fast and the impact of the mutual coupling can be determined.
    Original languageUndefined
    Title of host publication2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
    Place of PublicationUSA
    PublisherIEEE Electromagnetic Compatibility Society
    Pages181-183
    Number of pages3
    ISBN (Print)978-1-4673-9494-9
    DOIs
    Publication statusPublished - 19 May 2016
    Event2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016 - Shenzhen, China
    Duration: 17 May 201621 May 2016

    Publication series

    Name
    PublisherIEEE Electromagnetic Compatibility Society

    Conference

    Conference2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016
    Abbreviated titleAPEMC
    CountryChina
    CityShenzhen
    Period17/05/1621/05/16

    Keywords

    • METIS-318492
    • IR-101046
    • EWI-27142

    Cite this

    Moonen, D. J. G., Buesink, F. J. K., & Leferink, F. B. J. (2016). Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction. In 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) (pp. 181-183). USA: IEEE Electromagnetic Compatibility Society. https://doi.org/10.1109/APEMC.2016.7523002