Abstract
Aluminum-Induced Crystallization is applied on crystalline Si substrates. By this method a physical-vapor-deposited amorphous Si layer is successfully transformed into a monocrystalline solid-phase epitaxy (SPE) p-doped layer at an anneal temperature of 400°C. The as-grown epitaxial layer takes on the orientation and the lattice constant of the substrate. It is shown that a complete coverage over large areas is possible if the c-Si interface is free of nucleation centers. This can be achieved by the proper oxide-patterning and/or chemical treatments of the substrate surface before deposition of the Al mediator layer. High-quality p+n diodes have been fabricated with areas up to 1×1 cm2, having ideality factors down to 1.02 and low leakage currents in the 2-3 nA/cm2 range. The full coverage by p+ SPE-Si is confirmed by material analysis.
Original language | English |
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Title of host publication | 2012 Proceedings of the European Solid-State Device Research Conference, ESSDERC 2012 |
Pages | 145-148 |
Number of pages | 4 |
DOIs | |
Publication status | Published - 11 Dec 2012 |
Externally published | Yes |
Event | 42nd European Solid-State Device Research Conference, ESSDERC 2012 - Bordeaux, France Duration: 17 Sept 2012 → 21 Sept 2012 Conference number: 42 |
Conference
Conference | 42nd European Solid-State Device Research Conference, ESSDERC 2012 |
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Abbreviated title | ESSDERC |
Country/Territory | France |
City | Bordeaux |
Period | 17/09/12 → 21/09/12 |