Experimental Performance of a 3D-Printed Hybrid Heat Pipe-Thermosyphon for Cooling of Power Electronics

Wessel W. Wits*, Davoud Jafari

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

    2 Citations (Scopus)
    1 Downloads (Pure)

    Abstract

    This paper presents an innovative metal 3D-printed hybrid heat pipe-thermosyphon for cooling of power electronics. This hybrid device has an evaporator design based on heat pipe technology, while the condenser design is based on a thermosyphon. An array of cubic fins is 3D printed on the inner surface of the evaporator bottom plate to enhance capillarity and evaporation rates. The thermal performance of the additively manufactured heat pipe-thermosyphon, fabricated from aluminium alloy, was examined under vertical orientation using acetone as the working fluid. Experiments were conducted to determine thermal resistances of the device by instrumenting thermocouples along the wall. The effects of liquid filling ratio and heat flux were examined. The results show that for a heat flux of 35 W/cm 2 a liquid filling ratio of 30% gave the best performance with a minimum evaporation, condensation and total thermal resistance of 0.086, 0.17 and 0.26 K/W, respectively.

    Original languageEnglish
    Title of host publicationTHERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
    PublisherIEEE
    ISBN (Electronic)9781538667590
    DOIs
    Publication statusPublished - 27 Dec 2018
    Event24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018 - Scandic Victoria Tower, Stockholm, Sweden
    Duration: 26 Sep 201828 Sep 2018
    Conference number: 24
    https://therminic2018.eu/

    Conference

    Conference24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018
    Abbreviated titleTHERMINIC 2018
    CountrySweden
    CityStockholm
    Period26/09/1828/09/18
    Internet address

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