Experimental Performance of a 3D-Printed Hybrid Heat Pipe-Thermosyphon for Cooling of Power Electronics

Wessel W. Wits; Davoud Jafari

doi:10.1109/THERMINIC.2018.8593314

Experimental Performance of a 3D-Printed Hybrid Heat Pipe-Thermosyphon for Cooling of Power Electronics

Wessel W. Wits^*, Davoud Jafari

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

10 Citations (Scopus)

33 Downloads (Pure)

Abstract

This paper presents an innovative metal 3D-printed hybrid heat pipe-thermosyphon for cooling of power electronics. This hybrid device has an evaporator design based on heat pipe technology, while the condenser design is based on a thermosyphon. An array of cubic fins is 3D printed on the inner surface of the evaporator bottom plate to enhance capillarity and evaporation rates. The thermal performance of the additively manufactured heat pipe-thermosyphon, fabricated from aluminium alloy, was examined under vertical orientation using acetone as the working fluid. Experiments were conducted to determine thermal resistances of the device by instrumenting thermocouples along the wall. The effects of liquid filling ratio and heat flux were examined. The results show that for a heat flux of 35 W/cm 2 a liquid filling ratio of 30% gave the best performance with a minimum evaporation, condensation and total thermal resistance of 0.086, 0.17 and 0.26 K/W, respectively.

Original language	English
Title of host publication	THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
Publisher	IEEE
ISBN (Electronic)	9781538667590
DOIs	https://doi.org/10.1109/THERMINIC.2018.8593314
Publication status	Published - 27 Dec 2018
Event	24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018 - Scandic Victoria Tower, Stockholm, Sweden Duration: 26 Sept 2018 → 28 Sept 2018 Conference number: 24 https://therminic2018.eu/

Conference

Conference	24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018
Abbreviated title	THERMINIC 2018
Country/Territory	Sweden
City	Stockholm
Period	26/09/18 → 28/09/18
Internet address	https://therminic2018.eu/

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10.1109/THERMINIC.2018.8593314

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@inproceedings{0628f8a1b78e4d06a3ad54aaa4124715,

title = "Experimental Performance of a 3D-Printed Hybrid Heat Pipe-Thermosyphon for Cooling of Power Electronics",

abstract = "This paper presents an innovative metal 3D-printed hybrid heat pipe-thermosyphon for cooling of power electronics. This hybrid device has an evaporator design based on heat pipe technology, while the condenser design is based on a thermosyphon. An array of cubic fins is 3D printed on the inner surface of the evaporator bottom plate to enhance capillarity and evaporation rates. The thermal performance of the additively manufactured heat pipe-thermosyphon, fabricated from aluminium alloy, was examined under vertical orientation using acetone as the working fluid. Experiments were conducted to determine thermal resistances of the device by instrumenting thermocouples along the wall. The effects of liquid filling ratio and heat flux were examined. The results show that for a heat flux of 35 W/cm 2 a liquid filling ratio of 30% gave the best performance with a minimum evaporation, condensation and total thermal resistance of 0.086, 0.17 and 0.26 K/W, respectively.",

author = "Wits, {Wessel W.} and Davoud Jafari",

year = "2018",

month = dec,

day = "27",

doi = "10.1109/THERMINIC.2018.8593314",

language = "English",

booktitle = "THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings",

publisher = "IEEE",

address = "United States",

note = "24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018, THERMINIC 2018 ; Conference date: 26-09-2018 Through 28-09-2018",

url = "https://therminic2018.eu/",

}

Wits, WW & Jafari, D 2018, Experimental Performance of a 3D-Printed Hybrid Heat Pipe-Thermosyphon for Cooling of Power Electronics. in THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings., 8593314, IEEE, 24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018, Stockholm, Sweden, 26/09/18. https://doi.org/10.1109/THERMINIC.2018.8593314

Experimental Performance of a 3D-Printed Hybrid Heat Pipe-Thermosyphon for Cooling of Power Electronics. / Wits, Wessel W.; Jafari, Davoud.
THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. IEEE, 2018. 8593314.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Wits, Wessel W.

AU - Jafari, Davoud

N1 - Conference code: 24

PY - 2018/12/27

Y1 - 2018/12/27

N2 - This paper presents an innovative metal 3D-printed hybrid heat pipe-thermosyphon for cooling of power electronics. This hybrid device has an evaporator design based on heat pipe technology, while the condenser design is based on a thermosyphon. An array of cubic fins is 3D printed on the inner surface of the evaporator bottom plate to enhance capillarity and evaporation rates. The thermal performance of the additively manufactured heat pipe-thermosyphon, fabricated from aluminium alloy, was examined under vertical orientation using acetone as the working fluid. Experiments were conducted to determine thermal resistances of the device by instrumenting thermocouples along the wall. The effects of liquid filling ratio and heat flux were examined. The results show that for a heat flux of 35 W/cm 2 a liquid filling ratio of 30% gave the best performance with a minimum evaporation, condensation and total thermal resistance of 0.086, 0.17 and 0.26 K/W, respectively.

AB - This paper presents an innovative metal 3D-printed hybrid heat pipe-thermosyphon for cooling of power electronics. This hybrid device has an evaporator design based on heat pipe technology, while the condenser design is based on a thermosyphon. An array of cubic fins is 3D printed on the inner surface of the evaporator bottom plate to enhance capillarity and evaporation rates. The thermal performance of the additively manufactured heat pipe-thermosyphon, fabricated from aluminium alloy, was examined under vertical orientation using acetone as the working fluid. Experiments were conducted to determine thermal resistances of the device by instrumenting thermocouples along the wall. The effects of liquid filling ratio and heat flux were examined. The results show that for a heat flux of 35 W/cm 2 a liquid filling ratio of 30% gave the best performance with a minimum evaporation, condensation and total thermal resistance of 0.086, 0.17 and 0.26 K/W, respectively.

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Experimental Performance of a 3D-Printed Hybrid Heat Pipe-Thermosyphon for Cooling of Power Electronics

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