Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactions

D.H. Tong; F.C. Gielens; Johan W. Berenschot; Meint J. de Boer; Johannes G.E. Gardeniers; W. Nijdam; C.J.M. van Rijn; Michael Curt Elwenspoek

doi:10.1109/MEMSYS.2002.984254

Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactions

D.H. Tong
, F.C. Gielens
, Johan W. Berenschot
, Meint J. de Boer
, Johannes G.E. Gardeniers
, W. Nijdam
, C.J.M. van Rijn
, Michael Curt Elwenspoek

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

4 Citations (Scopus)

263 Downloads (Pure)

Abstract

In this paper, a MEMS based wafer-scale palladium - silver alloy membrane (MWSPdAgM) is presented. This membrane has the potential to be used for hydrogen purification and other applications [1]. A palladium-silver alloy layer (pd-Ag) was prepared by co-sputtering. The thin Pd-Ag alloy has high hydrogen selectivity, high permeation rate as well as high mechanical and chemical stability. Typical flow rates of 0.5 mol H2 /m2.s have been measured with a minimal selectivity of 550 for H2/N2. Anodic bonding of thick glass to silicon was used to package the membrane and create a very robust module. The membrane has high mechanical strength and can withstand pressures up to 4 bars at room temperature. The presented fabrication method allows the development of a module for industrial applications that consists of a stack with a large number of glass/membrane plates.

Original language	English
Title of host publication	Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems
Publisher	IEEE
Pages	268-271
Number of pages	4
ISBN (Print)	0-7803-7185-2
DOIs	https://doi.org/10.1109/MEMSYS.2002.984254
Publication status	Published - 20 Jan 2002
Event	15th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2002 - Las Vegas, United States Duration: 20 Jan 2002 → 24 Jan 2002 Conference number: 15

Conference

Conference	15th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2002
Abbreviated title	MEMS
Country/Territory	United States
City	Las Vegas
Period	20/01/02 → 24/01/02

Keywords

EWI-12733
IR-43325
METIS-206359

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10.1109/MEMSYS.2002.984254

00984254Final published version, 470 KB

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Tong, D. H., Gielens, F. C., Berenschot, J. W., de Boer, M. J., Gardeniers, J. G. E., Nijdam, W., van Rijn, C. J. M., & Elwenspoek, M. C. (2002). Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactions. In Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (pp. 268-271). IEEE. https://doi.org/10.1109/MEMSYS.2002.984254

Tong, D.H. ; Gielens, F.C. ; Berenschot, Johan W. et al. / Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactions. Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems. IEEE, 2002. pp. 268-271

@inproceedings{ef1a2b8b048547cfac2ece8799870ae0,

title = "Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactions",

abstract = "In this paper, a MEMS based wafer-scale palladium - silver alloy membrane (MWSPdAgM) is presented. This membrane has the potential to be used for hydrogen purification and other applications [1]. A palladium-silver alloy layer (pd-Ag) was prepared by co-sputtering. The thin Pd-Ag alloy has high hydrogen selectivity, high permeation rate as well as high mechanical and chemical stability. Typical flow rates of 0.5 mol H2 /m2.s have been measured with a minimal selectivity of 550 for H2/N2. Anodic bonding of thick glass to silicon was used to package the membrane and create a very robust module. The membrane has high mechanical strength and can withstand pressures up to 4 bars at room temperature. The presented fabrication method allows the development of a module for industrial applications that consists of a stack with a large number of glass/membrane plates.",

keywords = "EWI-12733, IR-43325, METIS-206359",

author = "D.H. Tong and F.C. Gielens and Berenschot, \{Johan W.\} and \{de Boer\}, \{Meint J.\} and Gardeniers, \{Johannes G.E.\} and W. Nijdam and \{van Rijn\}, C.J.M. and Elwenspoek, \{Michael Curt\}",

year = "2002",

month = jan,

day = "20",

doi = "10.1109/MEMSYS.2002.984254",

language = "English",

isbn = "0-7803-7185-2",

pages = "268--271",

booktitle = "Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems",

publisher = "IEEE",

address = "United States",

note = "15th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2002, MEMS ; Conference date: 20-01-2002 Through 24-01-2002",

}

Tong, DH, Gielens, FC, Berenschot, JW, de Boer, MJ, Gardeniers, JGE, Nijdam, W, van Rijn, CJM & Elwenspoek, MC 2002, Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactions. in Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems. IEEE, pp. 268-271, 15th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2002, Las Vegas, Nevada, United States, 20/01/02. https://doi.org/10.1109/MEMSYS.2002.984254

Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactions. / Tong, D.H.; Gielens, F.C.; Berenschot, Johan W. et al.
Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems. IEEE, 2002. p. 268-271.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactions

AU - Tong, D.H.

AU - Gielens, F.C.

AU - Berenschot, Johan W.

AU - de Boer, Meint J.

AU - Gardeniers, Johannes G.E.

AU - Nijdam, W.

AU - van Rijn, C.J.M.

AU - Elwenspoek, Michael Curt

N1 - Conference code: 15

PY - 2002/1/20

Y1 - 2002/1/20

N2 - In this paper, a MEMS based wafer-scale palladium - silver alloy membrane (MWSPdAgM) is presented. This membrane has the potential to be used for hydrogen purification and other applications [1]. A palladium-silver alloy layer (pd-Ag) was prepared by co-sputtering. The thin Pd-Ag alloy has high hydrogen selectivity, high permeation rate as well as high mechanical and chemical stability. Typical flow rates of 0.5 mol H2 /m2.s have been measured with a minimal selectivity of 550 for H2/N2. Anodic bonding of thick glass to silicon was used to package the membrane and create a very robust module. The membrane has high mechanical strength and can withstand pressures up to 4 bars at room temperature. The presented fabrication method allows the development of a module for industrial applications that consists of a stack with a large number of glass/membrane plates.

AB - In this paper, a MEMS based wafer-scale palladium - silver alloy membrane (MWSPdAgM) is presented. This membrane has the potential to be used for hydrogen purification and other applications [1]. A palladium-silver alloy layer (pd-Ag) was prepared by co-sputtering. The thin Pd-Ag alloy has high hydrogen selectivity, high permeation rate as well as high mechanical and chemical stability. Typical flow rates of 0.5 mol H2 /m2.s have been measured with a minimal selectivity of 550 for H2/N2. Anodic bonding of thick glass to silicon was used to package the membrane and create a very robust module. The membrane has high mechanical strength and can withstand pressures up to 4 bars at room temperature. The presented fabrication method allows the development of a module for industrial applications that consists of a stack with a large number of glass/membrane plates.

KW - EWI-12733

KW - IR-43325

KW - METIS-206359

U2 - 10.1109/MEMSYS.2002.984254

DO - 10.1109/MEMSYS.2002.984254

M3 - Conference contribution

SN - 0-7803-7185-2

SP - 268

EP - 271

BT - Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems

PB - IEEE

T2 - 15th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2002

Y2 - 20 January 2002 through 24 January 2002

ER -

Tong DH, Gielens FC, Berenschot JW, de Boer MJ, Gardeniers JGE, Nijdam W et al. Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactions. In Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems. IEEE. 2002. p. 268-271 doi: 10.1109/MEMSYS.2002.984254

Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactions

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