Fabrication and mechanical testing of glass chips for high pressure synthetic or analytical chemistry

R.E. Oosterbroek, D.C. Hermes, M. Kakuta, F. Benito-Lopez, W. Verboom, J.G.E. Gardeniers, A. van den Berg

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Original language	English
Title of host publication	Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications
Editors	C.E. Hunt
Place of Publication	Pennington, NJ
Publisher	Electrochemical Society
ISBN (Print)	9781566771016
Publication status	Published - 11 Oct 2004
Event	Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004 - Halle, Germany Duration: 11 Oct 2004 → 12 Oct 2004

Conference	Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004
Abbreviated title	WBW-MEMS
Country/Territory	Germany
City	Halle
Period	11/10/04 → 12/10/04

Cite this

Oosterbroek, R. E., Hermes, D. C., Kakuta, M., Benito-Lopez, F., Verboom, W., Gardeniers, J. G. E., & van den Berg, A. (2004). Fabrication and mechanical testing of glass chips for high pressure synthetic or analytical chemistry. In C. E. Hunt (Ed.), Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications Electrochemical Society.

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title = "Fabrication and mechanical testing of glass chips for high pressure synthetic or analytical chemistry",

author = "R.E. Oosterbroek and D.C. Hermes and M. Kakuta and F. Benito-Lopez and W. Verboom and J.G.E. Gardeniers and {van den Berg}, A.",

year = "2004",

month = oct,

day = "11",

language = "English",

isbn = "9781566771016",

editor = "C.E. Hunt",

booktitle = "Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications",

publisher = "Electrochemical Society",

address = "United States",

note = "Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004, WBW-MEMS ; Conference date: 11-10-2004 Through 12-10-2004",

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Oosterbroek, RE, Hermes, DC, Kakuta, M, Benito-Lopez, F, Verboom, W , Gardeniers, JGE & van den Berg, A 2004, Fabrication and mechanical testing of glass chips for high pressure synthetic or analytical chemistry. in CE Hunt (ed.), Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications. Electrochemical Society, Pennington, NJ, Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004, Halle, Saxony-Anhalt, Germany, 11/10/04.

Fabrication and mechanical testing of glass chips for high pressure synthetic or analytical chemistry. / Oosterbroek, R.E.; Hermes, D.C.; Kakuta, M. et al.
Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications. ed. / C.E. Hunt. Pennington, NJ: Electrochemical Society, 2004.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

TY - GEN

T1 - Fabrication and mechanical testing of glass chips for high pressure synthetic or analytical chemistry

AU - Oosterbroek, R.E.

AU - Hermes, D.C.

AU - Kakuta, M.

AU - Benito-Lopez, F.

AU - Verboom, W.

AU - Gardeniers, J.G.E.

AU - van den Berg, A.

PY - 2004/10/11

Y1 - 2004/10/11

M3 - Conference contribution

SN - 9781566771016

BT - Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications

A2 - Hunt, C.E.

PB - Electrochemical Society

CY - Pennington, NJ

T2 - Wafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004

Y2 - 11 October 2004 through 12 October 2004

ER -