Fabrication and mechanical testing of glass chips for high pressure synthetic or analytical chemistry

R.E. Oosterbroek, D.C. Hermes, M. Kakuta, F. Benito-Lopez, W. Verboom, J.G.E. Gardeniers, A. van den Berg

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageEnglish
Title of host publicationProceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications
EditorsC.E. Hunt
Place of PublicationPennington, NJ
PublisherThe Electrochemical Society Inc.
ISBN (Print)9781566771016
Publication statusPublished - 11 Oct 2004
EventWafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004 - Halle, Germany
Duration: 11 Oct 200412 Oct 2004

Conference

ConferenceWafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004
Abbreviated titleWBW-MEMS
CountryGermany
CityHalle
Period11/10/0412/10/04

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