Fabrication and mechanical testing of glass chips for high pressure synthetic or analytical chemistry

R.E. Oosterbroek, D.C. Hermes, M. Kakuta, F. Benito-Lopez, W. Verboom, J.G.E. Gardeniers, A. van den Berg

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

Original languageEnglish
Title of host publicationProceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications
EditorsC.E. Hunt
Place of PublicationPennington, NJ
PublisherThe Electrochemical Society Inc.
ISBN (Print)9781566771016
Publication statusPublished - 11 Oct 2004
EventWafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004 - Halle, Germany
Duration: 11 Oct 200412 Oct 2004

Conference

ConferenceWafer-Bonding Workshop for MEMS Technologies, WBW-MEMS 2004
Abbreviated titleWBW-MEMS
CountryGermany
CityHalle
Period11/10/0412/10/04

Cite this

Oosterbroek, R. E., Hermes, D. C., Kakuta, M., Benito-Lopez, F., Verboom, W., Gardeniers, J. G. E., & van den Berg, A. (2004). Fabrication and mechanical testing of glass chips for high pressure synthetic or analytical chemistry. In C. E. Hunt (Ed.), Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications Pennington, NJ: The Electrochemical Society Inc..