Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA

E.A. Dijkstra, Wouter Olthuis, Johan G. Bomer, D.A. Kronemeijer, Piet Bergveld

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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    Abstract

    This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above
    Original languageUndefined
    Title of host publicationProceedings Berkeley MEMS 2001
    Place of PublicationPiscattaway, USA
    PublisherIEEE
    Pages-
    Number of pages4
    ISBN (Print)in press
    DOIs
    Publication statusPublished - 25 Aug 2001

    Publication series

    Name
    PublisherIEEE

    Keywords

    • METIS-200642
    • IR-42170

    Cite this

    Dijkstra, E. A., Olthuis, W., Bomer, J. G., Kronemeijer, D. A., & Bergveld, P. (2001). Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA. In Proceedings Berkeley MEMS 2001 (pp. -). Piscattaway, USA: IEEE. https://doi.org/10.1109/MEMSC.2001.992731
    Dijkstra, E.A. ; Olthuis, Wouter ; Bomer, Johan G. ; Kronemeijer, D.A. ; Bergveld, Piet. / Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA. Proceedings Berkeley MEMS 2001. Piscattaway, USA : IEEE, 2001. pp. -
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    keywords = "METIS-200642, IR-42170",
    author = "E.A. Dijkstra and Wouter Olthuis and Bomer, {Johan G.} and D.A. Kronemeijer and Piet Bergveld",
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    Dijkstra, EA, Olthuis, W, Bomer, JG, Kronemeijer, DA & Bergveld, P 2001, Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA. in Proceedings Berkeley MEMS 2001. IEEE, Piscattaway, USA, pp. -. https://doi.org/10.1109/MEMSC.2001.992731

    Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA. / Dijkstra, E.A.; Olthuis, Wouter; Bomer, Johan G.; Kronemeijer, D.A.; Bergveld, Piet.

    Proceedings Berkeley MEMS 2001. Piscattaway, USA : IEEE, 2001. p. -.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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    N2 - This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above

    AB - This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above

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    Dijkstra EA, Olthuis W, Bomer JG, Kronemeijer DA, Bergveld P. Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA. In Proceedings Berkeley MEMS 2001. Piscattaway, USA: IEEE. 2001. p. - https://doi.org/10.1109/MEMSC.2001.992731