Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA

E.A. Dijkstra, Wouter Olthuis, Johan G. Bomer, D.A. Kronemeijer, Piet Bergveld

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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Abstract

This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above
Original languageUndefined
Title of host publicationProceedings Berkeley MEMS 2001
Place of PublicationPiscattaway, USA
PublisherIEEE
Pages-
Number of pages4
ISBN (Print)in press
DOIs
Publication statusPublished - 25 Aug 2001

Publication series

Name
PublisherIEEE

Keywords

  • METIS-200642
  • IR-42170

Cite this

Dijkstra, E. A., Olthuis, W., Bomer, J. G., Kronemeijer, D. A., & Bergveld, P. (2001). Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA. In Proceedings Berkeley MEMS 2001 (pp. -). Piscattaway, USA: IEEE. https://doi.org/10.1109/MEMSC.2001.992731
Dijkstra, E.A. ; Olthuis, Wouter ; Bomer, Johan G. ; Kronemeijer, D.A. ; Bergveld, Piet. / Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA. Proceedings Berkeley MEMS 2001. Piscattaway, USA : IEEE, 2001. pp. -
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Dijkstra, EA, Olthuis, W, Bomer, JG, Kronemeijer, DA & Bergveld, P 2001, Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA. in Proceedings Berkeley MEMS 2001. IEEE, Piscattaway, USA, pp. -. https://doi.org/10.1109/MEMSC.2001.992731

Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA. / Dijkstra, E.A.; Olthuis, Wouter; Bomer, Johan G.; Kronemeijer, D.A.; Bergveld, Piet.

Proceedings Berkeley MEMS 2001. Piscattaway, USA : IEEE, 2001. p. -.

Research output: Chapter in Book/Report/Conference proceedingConference contributionAcademicpeer-review

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AB - This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above

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Dijkstra EA, Olthuis W, Bomer JG, Kronemeijer DA, Bergveld P. Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA. In Proceedings Berkeley MEMS 2001. Piscattaway, USA: IEEE. 2001. p. - https://doi.org/10.1109/MEMSC.2001.992731