Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA

E.A. Dijkstra, Wouter Olthuis, Johan G. Bomer, D.A. Kronemeijer, Piet Bergveld

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    Abstract

    This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above
    Original languageUndefined
    Title of host publicationProceedings Berkeley MEMS 2001
    Place of PublicationPiscattaway, USA
    PublisherIEEE
    Pages-
    Number of pages4
    ISBN (Print)in press
    DOIs
    Publication statusPublished - 25 Aug 2001
    EventMicroelectromechanical Systems Conference, 2001 - Berkeley, CA, USA
    Duration: 24 Aug 200126 Aug 2001

    Publication series

    Name
    PublisherIEEE

    Conference

    ConferenceMicroelectromechanical Systems Conference, 2001
    Period24/08/0126/08/01
    OtherAugust 24-26, 2001

    Keywords

    • METIS-200642
    • IR-42170

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