Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA

E.A. Dijkstra; Wouter Olthuis; Johan G. Bomer; D.A. Kronemeijer; Piet Bergveld

doi:10.1109/MEMSC.2001.992731

Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA

E.A. Dijkstra, Wouter Olthuis, Johan G. Bomer, D.A. Kronemeijer, Piet Bergveld

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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Abstract

This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above

Original language	Undefined
Title of host publication	Proceedings Berkeley MEMS 2001
Place of Publication	Piscattaway, USA
Publisher	IEEE
Pages	-
Number of pages	4
ISBN (Print)	in press
DOIs	https://doi.org/10.1109/MEMSC.2001.992731
Publication status	Published - 25 Aug 2001
Event	Microelectromechanical Systems Conference, 2001 - Berkeley, CA, USA Duration: 24 Aug 2001 → 26 Aug 2001

Publication series

Name
Publisher	IEEE

Conference

Conference	Microelectromechanical Systems Conference, 2001
Period	24/08/01 → 26/08/01
Other	August 24-26, 2001

Keywords

METIS-200642
IR-42170

Access to Document

10.1109/MEMSC.2001.992731

Fabrication_and_packaging_-_Dijkstra

Cite this

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title = "Fabrication and packaging of a miniature sensor array for harsh environments, Berkeley, USA",

abstract = "This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above",

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AU - Olthuis, Wouter

AU - Bomer, Johan G.

AU - Kronemeijer, D.A.

AU - Bergveld, Piet

N1 - In press

PY - 2001/8/25

Y1 - 2001/8/25

N2 - This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above

AB - This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above

KW - METIS-200642

KW - IR-42170

U2 - 10.1109/MEMSC.2001.992731

DO - 10.1109/MEMSC.2001.992731

M3 - Conference contribution

SN - in press

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BT - Proceedings Berkeley MEMS 2001

PB - IEEE

CY - Piscattaway, USA

T2 - Microelectromechanical Systems Conference, 2001

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