Abstract
This paper presents a new fabrication method to realize a channel underneath the surface of a single silicon substrate for micro Coriolis flow sensing application, as well as other multiparameter systems, such as thermal flow sensors. It allows to fabricate channels with a nearly perfect circular cross section without bonding of two wafers. With this technology, problems such as leakage, deformation of channels due to pressure and temperature that affect the performance of micro Coriolis flow sensor can be reduced significantly. Moreover, it leaves only very little topography on the surface of substrate, hence integration of actuation and readout systems by metal deposition can still be followed easily afterwards.
Original language | English |
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Pages | 103-105 |
Number of pages | 3 |
Publication status | Published - 2 Oct 2019 |
Event | 4th Conference on MicroFluidic Handling Systems, MFHS 2019 - De Kleine Willem, Enschede, Netherlands Duration: 2 Oct 2019 → 4 Oct 2019 Conference number: 4 https://www.mfhs2019.org/ |
Conference
Conference | 4th Conference on MicroFluidic Handling Systems, MFHS 2019 |
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Abbreviated title | MFHS 2019 |
Country/Territory | Netherlands |
City | Enschede |
Period | 2/10/19 → 4/10/19 |
Internet address |