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Fabrication of 3d nanowire frames by conventional micromachining technology

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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    Abstract

    We report on a simple parallel processing method capable of producing addressable three-dimensional (3D) nanometer-sized structures, such as wires, wire frames and dots. The method, which is fully compatible with standard micromachining, employs isotropic removal of conformally deposited material onto a prepared template, to form nanostructures in the concave corners of the template. The process results in well-defined nanometer scale structures with exact position and spatial arrangement fully determined by the template. An etching mask with nanometer size features and a nanowire pyramid on a freestanding cantilever have been successfully fabricated, demonstrating the feasibility and potential of this technology
    Original languageUndefined
    Title of host publicationProceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems 2005
    Place of PublicationLos Alamitos
    PublisherIEEE
    Pages27-30
    Number of pages4
    ISBN (Print)0-7803-8994-8
    DOIs
    Publication statusPublished - Jun 2005
    Event13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005 - Seoul, Korea, Republic of
    Duration: 5 Jun 2005 → 9 Jun 2005
    Conference number: 13

    Publication series

    Name
    PublisherIEEE
    Number05TH8791
    Volume1

    Conference

    Conference13th International Conferences on Solid-State Sensors, Actuators and Mircosystems, TRANSDUCERS 2005
    Abbreviated titleTRANSDUCERS 2005
    Country/TerritoryKorea, Republic of
    CitySeoul
    Period5/06/05 → 9/06/05

    UN SDGs

    This output contributes to the following UN Sustainable Development Goals (SDGs)

    1. SDG 9 - Industry, Innovation, and Infrastructure
      SDG 9 Industry, Innovation, and Infrastructure

    Keywords

    • EWI-10274
    • METIS-224196
    • IR-52577

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