This paper describes the design and production process of a variety of reliable micro cryogenic coolers. The different cold stages are based on an optimized design found during a study which was done to maximize the cold-stage effectiveness. Typical cold-stage dimensions are 30 × 2 × 0.5 mm with an expected net cooling power varying from 10 mW to 20 mW at a tip temperature of 96 K. A cold stage consists of a stack of three fusion bonded D263T glass wafers. The production process has 7 lithography steps and roughly 100 process steps. In order to determine the maximum bend, shear and bond stresses inside a 175 µm thick D263T glass wafer, several pressure tests were performed.
Lerou, P. P. M., Venhorst, G. C. F., Berends, C. F., Veenstra, T. T., Blom, M., Burger, J. F., ... Rogalla, H. (2006). Fabrication of a micro cryogenic cooler using MEMS-technology. Journal of micromechanics and microengineering, 16, 1919-1925. https://doi.org/10.1088/0960-1317/16/10/002